In this work, we demonstrate, for the first time, Al0.35GaN/GaN/Al0.25GaN double heterostructure field effect transistors on 200 mm Si(111) substrates. Thick crack-free Al0.25GaN buffer layers are achieved by optimizing Al0.75GaN/Al0.5GaN intermediate layers and AlN nucleation layers. The highest buffer breakdown voltage reaches 1380 V on a sample with a total buffer thickness of 4.6 µm. According to Van der Pauw Hall measurements, the electron mobility is 1766 cm2 V-1 s-1 and the electron density is 1.16×1013 cm-2, which results in a very low sheet resistance of 306±8 Ω/square.

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