The mechanism for low-temperature photoluminescence (PL) emissions in GaNAs epilayers and GaAs/GaNxAs1−x quantum well (QW) structures grown by molecular-beam epitaxy is studied in detail, employing PL, PL excitation, and time-resolved PL spectroscopies. It is shown that even though quantum confinement causes a strong blueshift of the GaNAs PL emission, its major characteristic properties are identical in both QW structures and epilayers. Based on the analysis of the PL line shape, its dependence on the excitation power and measurement temperature, as well as transient data, the PL emission is concluded to be caused by a recombination of excitons trapped by potential fluctuations in GaNAs.
The optical signatures of Mg-related acceptors in GaN have been revisited in samples specifically grown on bulk GaN templates, to avoid strain broadening of the optical spectra. Bound-exciton spectra can be studied in these samples for Mg concentrations up to [Mg] approximately 2 x 10(19) cm(-3). Contrary to previous work it is found that instabilities in the photoluminescence spectra are not due to unstable shallow donors, but to unstable Mg-related acceptors. Our data show that there are two Mg-related acceptors simultaneously present: the regular (stable) substitutional Mg acceptor, and a complex acceptor which is unstable in p-GaN.
Although perovskite light-emitting diodes (PeLEDs) have recently experienced significant progress, there are only scattered reports of PeLEDs with both high efficiency and long operational stability, calling for additional strategies to address this challenge. Here, we develop perovskite-molecule composite thin films for efficient and stable PeLEDs. The perovskite-molecule composite thin films consist of in-situ formed high-quality perovskite nanocrystals embedded in the electron-transport molecular matrix, which controls nucleation process of perovskites, leading to PeLEDs with a peak external quantum efficiency of 17.3% and half-lifetime of approximately 100 h. In addition, we find that the device degradation mechanism at high driving voltages is different from that at low driving voltages. This work provides an effective strategy and deep understanding for achieving efficient and stable PeLEDs from both material and device perspectives.
A systematic investigation of the effect of rapid thermal annealing (RTA) on optical properties of undoped GaNAs/GaAs structures is reported. Two effects are suggested to account for the observed dramatic improvement in the quality of the GaNxAs1−x/GaAs quantum structures after RTA: (i) improved composition uniformity of the GaNxAs1−x alloy, deduced from the photoluminescence (PL), PL excitation and time-resolved measurements; and (ii) significant reduction in the concentration of competing nonradiative defects, revealed by the optically detected magnetic resonance studies.
Time resolved photoluminescence spectroscopy is employed to monitor the effect of N incorporation on the band structure of GaNP alloys. Abrupt shortening in radiative lifetime of near-band gap emissions, arising from excitonic radiative recombination within N-related centers, is found to occur at very low N compositions of around 0.5%, i.e., within the same range as the appearance of the direct-band gap-like transitions in the photomodulated transmission spectra of GaNP reported previously. The effect has been attributed to an enhancement in oscillator strength of optical transitions due to band crossover from indirect to direct-band gap of the alloy.
Currently, up to 50% of the channel temperature in AlGaN/GaN electronic devices is due to the thermal-boundary resistance (TBR) associated with the nucleation layer (NL) needed between GaN and SiC substrates for high-quality heteroepitaxy. Using 3-D time-resolved Raman thermography, it is shown that modifying the NL used for GaN on SiC epitaxy from the metalorganic chemical vapor deposition (MOCVD)-grown standard AlN-NL to a hot-wall MOCVD-grown AlN-NL reduces NL TBR by 25%, resulting in ∼10% reduction of the operating temperature of AlGaN/GaN HEMTs. Considering the exponential relationship between device lifetime and temperature, lower TBR NLs open new opportunities for improving the reliability of AlGaN/ GaN devices.
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