Abstract-We report on a heterogeneously integrated InP/SOI laser source realized through DVS-BCB wafer bonding. The hybrid lasers present several new features. The III-V laser is only 1.7μm wide, reducing the power consumption of the device. The silicon waveguide thickness is 400 nm, compatible with highperformance modulator designs and allowing efficient coupling to a standard 220nm high index contrast silicon waveguide layer. In order to make the mode coupling efficient, both the III-V waveguide and silicon waveguide are tapered, with a tip width for the III-V waveguide of around 800 nm. These new features lead to good laser performance: a lasing threshold as low as 30mA and an output power of more than 4mW at room temperature in continous wave operation regime. Continuous wave lasing up to 70C is obtained.Index Terms-Hybrid integrated circuits, silicon laser, silicon-on-insulator (SOI) technology, adiabatic taper.

An interface characterization technique, termed the Fermi-level efficiency (FLE) method, is proposed for evaluating the passivation level of high trap density oxide-semiconductor interfaces. Based on the characteristic charge trapping time-energy relation and the conductance method, the FLE method examines the Fermi-level displacement at the oxide-semiconductor interface under applied gate bias. The obtained Fermi-level efficiencies can be used to assess the interface qualities of metal-oxide-semiconductor devices with III-V and other novel substrate materials.

Abstract-This paper summarizes recent advances of integrated hybrid InP/SOI lasers and transmitters based on wafer bonding. At first the integration process of III-V materials on silicon is described. Then the paper reports on the results of single wavelength distributed Bragg reflector lasers with Bragg gratings etched on silicon waveguides. We then demonstrate that, thanks to the high-quality silicon bend waveguides, hybrid III-V/Si lasers with two integrated intra-cavity ring resonators can achieve a wide thermal tuning range, exceeding the C band, with a side mode suppression ratio higher than 40 dB. Moreover, a compact array waveguide grating on silicon is integrated with a hybrid III-V/Si gain section, creating a wavelength-selectable laser source with 5 wavelength channels spaced by 400 GHz. We further demonstrate an integrated transmitter with combined silicon modulators and tunable hybrid III-V/Si lasers. The integrated transmitter exhibits 9 nm wavelength tunability by heating an intra-cavity ring resonator, high extinction ratio from 6 to 10 dB, and excellent bit-error-rate performance at 10 Gb/s. Index Terms-Hybrid photonic integrated circuits, silicon laser, semiconductor lasers, silicon-on-insulator (SOI) technology, adiabatic taper.

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We introduce the concept of dual-illuminated photodetectors for high-power applications. Illuminating the photodetector on both sides doubles the number of optical channels, boosting DC and RF power handling capability. This concept is demonstrated utilizing multiple-stage dual-illuminated traveling wave photodetector circuits in silicon photonics, showing a maximum DC photocurrent of 112 mA and a 3-dB bandwidth of 40 GHz at 0.3 mA. Peak continuous-wave RF power is generated up to 12.3 dBm at 2 GHz and 5.3 dBm at 40 GHz, at a DC photocurrent of 55 mA. High speed broadband data signals are detected with eye amplitudes of 2.2 V and 1.3 V at 10 Gb/s and 40 Gb/s, respectively. A theoretical analysis is presented illustrating design tradeoffs for the multiple-stage photodetector circuits based on the bandwidth and power requirements.

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