Spin-transfer torque magnetic random access memory (STT-MRAM) is considered as a replacement for next generation embedded and stand-alone memory applications. One of the main challenges in the STT-MRAM stack development is the compatibility of the stack with CMOS process flows in which thermal budgets up to 400 °C are applied. In this letter, we report on a perpendicularly magnetized MgO-based tunnel junction (p-MTJ) on a thin Co/Ni perpendicular synthetic antiferromagnetic layer with high annealing tolerance. Tunnel magneto resistance (TMR) loss after annealing occurs when the reference layer loses its perpendicular magnetic anisotropy due to reduction of the CoFeB/MgO interfacial anisotropy. A stable Co/Ni based p-MTJ stack with TMR values of 130% at resistance-area products of 9 Ω μm2 after 400 °C anneal is achieved via moment control of the Co/Ta/CoFeB reference layer. Thinning of the CoFeB polarizing layer down to 0.8 nm is the key enabler to achieve 400 °C compatibility with limited TMR loss. Thinning the Co below 0.6 nm leads to a loss of the antiferromagnetic interlayer exchange coupling strength through Ru. Insight into the thickness and moment engineering of the reference layer is displayed to obtain the best magnetic properties and high thermal stability for thin Co/Ni SAF-based STT-MRAM stacks.

Work softening in aluminum and its alloys (AI-2Fe) was investigated at room temperature. Work softening was noticed in aluminum with a purity of 99.996 %, in an AI-2Fe alloy with a purity of 99.996 % in the aluminum matrix, and in an AI-2Fe alloy with a purity of 99.96 % in the aluminum matrix, when the reduction in thickness of samples after rolling is more than 80 %, 60 %, and 90 %, respectively. Work softening was mainly related to the recovery at room temperature. The addition of iron to aluminum purifies the aluminum matrix. The dispersed second phases formed by aluminum and iron may promote the recovery.

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Analogous device parameters in both the parallel (P) and anti-parallel (AP) states ensure a symmetric spin-transfer-torque magnetic random-access memory operation scheme. In this study, however, we observe an increasing asymmetry in the performance metrics with operating temperature of the bottom-pinned perpendicular magnetic tunnel junction (p-MTJ) devices. A temperature-dependent increase in the contribution of the stray field is observed in the tunneling magnetoresistance loop analysis. The switching current for P-to-AP decreases by 30% in the thermally activated switching regime by increasing the temperature from 300 K to 400 K, while it remains similar for AP-to-P. In addition, with the same temperature range, the thermal stability factor for the P state decreases 20% more than that for the AP state. We attribute those observations to the increase in the overcompensation of the stray field from the synthetic anti-ferromagnet structure. Saturation magnetization (MS) of the [Co/Pt]x-based multilayers is much less affected by temperature [MS(400 K)/MS(300 K) = 97%] compared to that of the CoFeB-based multilayers (88%). Such an impact can be more severe during the electrical switching process due to the Joule heating effect. These results suggest that, to understand and to evaluate the performance in a wide range of temperatures, it is crucial to consider the contribution of the entire magnetic components in the p-MTJ stack.

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