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We demonstrate for the first time full-scale integration of top-pinned perpendicular MTJ on 300 mm wafer using CMOS-compatible processes for spin-orbit torque (SOT)-MRAM architectures. We show that 62 nm devices with a Wbased SOT underlayer have very large endurance (> 5x10 10 ), sub-ns switching time of 210 ps, and operate with power as low as 300 pJ.Introduction: The introduction of non-volatility (NV) at the cache level in advance logic nodes is sought as it would lead to a large decrease of the power consumption of microprocessors. Among NV memory technologies, spin-transfer torque (STT) MRAM has gained a lot of attention due to its scalability, low power and high speed, as well as compatibility with scaled CMOS processes and voltages. Despite all these advantages, STT-MRAM cannot operate reliably at ns and sub-ns scales due to large incubation delays [1,2], making it an unsuitable solution to tackle L1/2 SRAM cache replacement. In addition, the shared read/write path can impair the read reliability, while the write current can impose severe stress on the MTJ, leading to time dependent degradation of the memory cell. To mitigate these issues, spin-orbit torque (SOT)-MRAM has been recently proposed [2,3]. SOT induces switching of the free layer (FL) of the MTJ by injecting an in-plane current in an adjacent SOT layer, typically with the assistance of a static in-plane magnetic field [2]. This enables a three terminal MTJ-based concept that isolates the read/write path (Fig. 1), significantly improving the device endurance and read stability. Moreover, due to SOT spin transfer geometry, incubation time is negligible which allows for reliable switching operation at sub-ns timescales [4,5]. Here, we report the first successful integration of SOT-MTJ cells on 300 mm wafers using CMOS-compatible processes. We demonstrate low power sub-ns switching and pathways for further optimization. Finally, excellent endurance and absence of electro-migration effect of ultrathin SOT layers are shown.Integration flow: We used a SOT dedicated mask set in the imec 300 mm fab. The main steps of the integration process are summarized in Fig. 2: a SOT-MTJ stack is deposited on smooth bottom electrodes (BE), which are fabricated using a tungsten (W) damascene process. The MTJ is top pinned and consist of SOT/CoFeB/MgO/CoFeB/SAF perpendicularly magnetized (PMA) stack, where the SOT layer is W-based. Specific stop etch conditions have been developed to leave the SOT layer intact while patterning the MTJ pillar without producing sidewall shorts across the MgO barrier (Fig. 2c,d). Subsequently, the SOT layer is etched to form the three terminal device and a dual damascene Cu top electrode (TE) was fabricated to complete the electrical connection ( Fig. 2a).Stack development: SOTs possess a damping-like term (τDL) attributed to spin Hall and a field-like term (τFL) attributed to interface interactions [2]. Recent work indicates that τDL triggers switching while τFL accelerates it [5]. Charge-to-spin conversion efficiency parameters θDL and...

Articles you may be interested inDetailed leakage current analysis of metal-insulator-metal capacitors with ZrO2, ZrO2/SiO2/ZrO2, and ZrO2/Al2O3/ZrO2 as dielectric and TiN electrodes J. Vac. Sci. Technol. B 31, 01A109 (2013); 10.1116/1.4768791 Impact of bottom electrode and Sr x Ti y O z film formation on physical and electrical properties of metalinsulator-metal capacitors Appl. Phys. Lett. 98, 182902 (2011); 10.1063/1.3584022 Influence of precursor chemistry and growth temperature on the electrical properties of SrTiO 3 -based metalinsulator-metal capacitors grown by atomic layer deposition J. Vac. Sci. Technol. B 29, 01AC04 (2011); 10.1116/1.3525280 Impact of crystallization behavior of Sr x Ti y O z films on electrical properties of metal-insulator-metal capacitors with TiN electrodes Appl. Phys. Lett. 97, 162906 (2010); 10.1063/1.3505323 Atomic-layer-deposited Al 2 O 3 -Hf O 2 -Al 2 O 3 dielectrics for metal-insulator-metal capacitor applications Appl. Phys. Lett.In this work, the physical and electrical properties of Sr x Ti 1−x O y ͑STO͒-based metal-insulator-metal capacitors ͑MIMcaps͒ with various compositions are studied in detail. While most recent studies on STO were done on noblelike metal electrodes ͑Ru, Pt͒, this work focuses on a low temperature ͑250°C͒ atomic layer deposition ͑ALD͒ process, using an alternative precursor set and carefully optimized processing conditions, enabling the use of low-cost, manufacturable-friendly TiN electrodes. Physical analyses show that the film crystallization temperature, its texture and morphology strongly depends on the Sr/Ti ratio. Such physical variations have a direct impact on the electric properties of Sr x Ti 1−x O y based capacitors. It is found that Sr-enrichment result in a monotonous decrease in the dielectric constant and leakage current as predicted by ab initio calculations. The intercept of the EOT vs physical thickness plot further indicates that increasing the Sr-content at the film interface with the bottom TiN would result in lower interfacial equivalent-oxide thickness.

We study ns scale spin-torque-induced switching in perpendicularly magnetized tunnel junctions (pMTJ). Although the switching voltages match with the macrospin instability threshold, the electrical signatures of the reversal indicate the presence of domain walls in junctions of various sizes. In the antiparallel (AP) to parallel (P) switching, a nucleation phase is followed by an irreversible flow of a wall through the sample at an average velocity of 40 m/s with back and forth oscillation movements indicating a Walker propagation regime. A model with a single-wall locally responding to the spin-torque reproduces the essential dynamical signatures of the reversal. The P to AP transition has a complex dynamics with dynamical back-hopping whose probability increases with voltage. We attribute this back-hopping to the instability of the nominally fixed layers.The spin-transfer-torque (STT) manipulation of the magnetization is a cornerstone of modern spintronics. In magnetic tunnel junctions (MTJ), the interplay between magnetizationdependent transport properties 1,2 and the spin torques results in a rich variety of phenomena 3 . After the discovery of STT, it was soon realized 4,5 that the cylindrical symmetry of the magnetic properties in Perpendicular Magnetic Anisotropy (PMA) systems and the resilience to thermal fluctuations that the anisotropy provides would make PMA systems ideal playgrounds to explore STT-induced dynamics. However MTJs with relevant properties became available only a decade after 6 and relied on ultrathin systems where strong interfacial effects can be present 7 ; besides, efficient spin-torque generation requires complex embedding stacks 8,9 in which each additional layers can be a fluctuator strongly coupled to the layer of main interest in a non uniform 8,10 and non local 11 manner. As a consequence the STT-induced magnetization switching in PMA MTJ systems exhibits rich features 12,13 that deserve to be studied, especially as it opens opportunities in information technologies.In this letter, we report single-shot time-resolved measurements of ns-scale STT switching events in PMA MTJs. We detail the electrical signature of the switching and account for its main features using a simple formalism. After an observable nucleation, the reversal proceeds in a non uniform manner with the motion of a domain wall (DW) in a Walker regime; this comes together with intensified excitations in the nominally fixed layers that can result in dynamical back-hopping. This complex dynamics calls for a revisit of the models describing the stability of magnetization and its switching under STT in perpendicularly magnetized confined systems. Our findings are also important for the understanding of other spin torque devices like spin majority gates 14 where the degree of coherence of the magnetization -the occurrence or non occurrence of domain walls-is crucial. The paper is organized as follows. We first describe in detail the properties of the thin films from which the samples are fabricated (section I). The d...