Using a thermal wave imaging system we have been able to detect and identify a variety of microscopic defects commonly found in fine metal Al connector lines used in the IC industry. The defects of interest are hillocks, surface and subsurface Si and Cu precipitates and subsurface voids and notches. Defects as small as 0.1 ~m have been detected. This thermal wave imaging system has also been used to detect subsurface defects in Al and W metal contact plugs.
Controlling the size and distribution of silicon precipitates in aluminum alloy depositions is important for yield enhancement and reliability of small geometry metal interconnects. A non-contact and non-destructive thermal wave imaging technique is used to detect and evaluate size and density of silicon precipitates in AISi and AlSiCu alloys. The thermal wave results are corroborated with SEM and Auger data.
scite is a Brooklyn-based organization that helps researchers better discover and understand research articles through Smart Citations–citations that display the context of the citation and describe whether the article provides supporting or contrasting evidence. scite is used by students and researchers from around the world and is funded in part by the National Science Foundation and the National Institute on Drug Abuse of the National Institutes of Health.