Silicon Precipitate Detection in Al-Si and Al-Si-Cu Metal Interconnect by Thermal Wave Imaging

Abstract

Controlling the size and distribution of silicon precipitates in aluminum alloy depositions is important for yield enhancement and reliability of small geometry metal interconnects. A non-contact and non-destructive thermal wave imaging technique is used to detect and evaluate size and density of silicon precipitates in AISi and AlSiCu alloys. The thermal wave results are corroborated with SEM and Auger data.