The saturation in dimensional scaling has clearly impacted the semiconductor technology roadmap. The extension of patterning cliffs through new tools and multi-patterning lithography, as well as the introduction of innovative scaling boosters is helping in optimally scaling the Power-Performance-Area (PPA) metrics. However, because of the increase in the process complexity and reduced area benefits, manufacturing cost is increasing. Therefore, moving to a PPA-Cost (PPAC) methodology to monitor and analyze the cost of a technology is becoming increasingly necessary.
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