1997
DOI: 10.1016/s0040-6090(97)00485-9
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The characterization of etched GaAs surface with HCl or H3PO4 solutions

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Cited by 28 publications
(13 citation statements)
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“…Indeed, the bath composition plays also a rule in GaAs etching rate. A XPS study, proposed by Kang et al 31 confirms our analysis, by showing the presence of specific bonds like Ga-PO 4 and As-PO 4 during an etching in a H 3 PO 4 bath and Ga-Cl bonds during a hydrochloric acid etching.…”
Section: Influence Of Etching Bath Compositionsupporting
confidence: 89%
“…Indeed, the bath composition plays also a rule in GaAs etching rate. A XPS study, proposed by Kang et al 31 confirms our analysis, by showing the presence of specific bonds like Ga-PO 4 and As-PO 4 during an etching in a H 3 PO 4 bath and Ga-Cl bonds during a hydrochloric acid etching.…”
Section: Influence Of Etching Bath Compositionsupporting
confidence: 89%
“…GaAs substrate has a complex surface chemical bond state before wet cleaning treatment. Ga-As, Ga-O and Ga-Ga bond can be find in the XPS spectra of Ga, and As-Ga, As-O and As-As bond also can be found in the XPS spectra of As [17]. As shown in Figs.…”
Section: Resultsmentioning
confidence: 58%
“…In comparison with the HCl treatment, the buffered HF solution appears to produce a surface not as readily wet by Au under the experimental conditions studied, so more discrete and isolated islands are formed. Differences due to surface passivation with the consequent H [21] or Cl surface termination [22,23] resulting from the chemical treatments A or B, respectively, could be at the origin of this behavior.…”
Section: Discussionmentioning
confidence: 99%