The Application of Hydrogenation to Amorphous Silicon Thin Film Transistors for the Decrease of the off Current

Kobayashi, Kenzo; Murai, H.; Hayama, Masahiro; Yamazaki, Teruhiko

doi:10.1557/proc-219-321

Cited by 10 publications

(2 citation statements)

References 5 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…When the OFETs are heated at a high temperature, e.g., 85 °C, the devices may suffer performance degradation. For example, it has been reported that I off in the device increases exponentially with temperature, and the correspondingly increased energy loss is detrimental to the OFETs in practical operating scenarios . As shown in Figure d, for the neat device after heating, I off and threshold voltage are shifted up (∼10 –9 A) and to the right (∼18 V), respectively.…”

Section: Resultsmentioning

confidence: 99%

“…For example, it has been reported that I off in the device increases exponentially with temperature, and the correspondingly increased energy loss is detrimental to the OFETs in practical operating scenarios. 19 As shown in Figure 1d, for the neat device after heating, I off and threshold voltage are shifted up (∼10 −9 A) and to the right (∼18 V), respectively. Conversely, such a high temperature has no significant effect on OFETs made of blends comprising 2% PS, at which their comparatively low I off of ∼10 −10 A and threshold voltage of ∼8 V contribute to reduced power consumption in the device.…”

Section: Introductionmentioning

confidence: 80%

See 1 more Smart Citation

Heat Transfer Enhancement of n-Type Organic Semiconductors by an Insulator Blend Approach

Zhang

Tang

Wang

et al. 2022

ACS Appl. Mater. Interfaces

View full text Add to dashboard Cite

The transfer of heat energy in organic semiconductors (OSCs) plays an important role in advancing the applications of organic electronics, especially for lifetime issues. However, compared with crystalline inorganic semiconductors, the thermal transport of OSCs is less efficient and a relevant understanding is very limited. In this contribution, we show that the heat conduction of OSCs can be enhanced by blending with a “commodity” insulator (both thermal and electrical). PC71BM, a well-known electron transporter but poor thermal conductor, was selected as the host OSC material. The blending of a small amount of polystyrene (PS), a commonly used insulating polymer, can facilitate the heat transfer of PC71BM films, as substantiated by the scanning photothermal deflection technique and an infrared thermal camera. The phase thermodynamics of PC71BM/PS blends indicates that the efficient heat transfer preferably occurs in the OSC/insulator blends with better intimate mixing, where isolated PC71BM domains can be effectively bridged by PS that thread through the regions. The applicability of this approach can be observed in blends with another host materialITIC. This work provides a facile strategy for designing thermally durable organic electronic devices.

show abstract

Section: Resultsmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 80%