2022
DOI: 10.1016/j.mejo.2022.105590
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Substrate BOX engineering to mitigate the self-heating induced degradation in nanosheet transistor

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Cited by 6 publications
(1 citation statement)
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“…This causes a detectable change in the figure-of-merits (FoMs), such as ON current (I ON ), OFF current (I OFF ), subthreshold swing (SS), threshold voltage (V TH ), etc, of the underlying transistor. Unlike planar MOSFET, the FinFET-based non-planar logic devices are in volume production for the advanced technology node due to their superior gate electrostatics integrity, subsided gate leakage, and providing immunity against severe short channel effects (SCEs) [14,15]. In continuation of advancement, junctionless FETs (JLFETs) could be the preferable choice over the conventional ones due to the CMOS-compatible fabrication process flow and prevention of mobility degradation from surface roughness scattering.…”
Section: Introductionmentioning
confidence: 99%
“…This causes a detectable change in the figure-of-merits (FoMs), such as ON current (I ON ), OFF current (I OFF ), subthreshold swing (SS), threshold voltage (V TH ), etc, of the underlying transistor. Unlike planar MOSFET, the FinFET-based non-planar logic devices are in volume production for the advanced technology node due to their superior gate electrostatics integrity, subsided gate leakage, and providing immunity against severe short channel effects (SCEs) [14,15]. In continuation of advancement, junctionless FETs (JLFETs) could be the preferable choice over the conventional ones due to the CMOS-compatible fabrication process flow and prevention of mobility degradation from surface roughness scattering.…”
Section: Introductionmentioning
confidence: 99%