2017
DOI: 10.1016/j.sse.2016.10.023
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Study of silicon n- and p-FET SOI nanowires concerning analog performance down to 100K

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Cited by 11 publications
(8 citation statements)
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“…One group consisted of measured experimental nanowire and nanosheet transistors fabricated by CEA-Leti [6,20] and the other were simulated transistors. Experimental transistors were measured at 25 • C and fabricated in SOI substrates with 145 nm thick buried oxide.…”
Section: Sddgm Model Validation For Nanowires and Nanosheetsmentioning
confidence: 99%
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“…One group consisted of measured experimental nanowire and nanosheet transistors fabricated by CEA-Leti [6,20] and the other were simulated transistors. Experimental transistors were measured at 25 • C and fabricated in SOI substrates with 145 nm thick buried oxide.…”
Section: Sddgm Model Validation For Nanowires and Nanosheetsmentioning
confidence: 99%
“…A special FinFET structure with three gates, when the transistor fin height (H FIN ) and fin width (W FIN ) have similar dimensions, is known as nanowire, as depicted in figure 1(a). These 3D nanowire structures have been extensively studied [4][5][6]. Now, for a new generation of integrated circuits, a new MOSFET structure known as nanosheet, presented in figure 1(b), is under development, which is a four-gate or a gate-all-around (GAA) transistor.…”
Section: Introductionmentioning
confidence: 99%
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“…The influence of strain on the electrical characteristics of SOI nanowires has been studied as well [22]. Figure 6 presents the extracted effective carrier mobility as a function of VGT, obtained with drain bias of 40 mV and different WFIN values, for L=10 µm SOI and sSOI nanowires at room temperature.…”
Section: A Operation At 300 Kmentioning
confidence: 99%
“…Mobility is a key quantity in electronic transport that provides an understanding of the physical processes affecting the motion of free carriers [1][2][3][4]. Comparative analysis of mobility as a key figure of merit of heterosystems is of great importance in synthesizing novel materials, developing novel thin-film technologies, interface modification, controlling fabrication of films and devices on their base [5][6][7][8][9][10].…”
Section: Introductionmentioning
confidence: 99%