Selective electroless Ni deposition on a TiW underlayer for integrated circuit fabrication

Dubin, Valery M.; Lopatin, S.; Sokolov, V. G.

doi:10.1016/0040-6090(93)90210-g

Cited by 4 publications

(1 citation statement)

References 10 publications

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“…The choice of these elements depends on the applications sought after. The applications of Ni-Cu-P in VLSI [7,8] and in thin-film memory discs [9] were considered.…”

Section: Introductionmentioning

confidence: 99%

Corrosion Resistance of Electroless Ni-Cu-P Ternary Alloy Coatings in Acidic and Neutral Corrosive Mediums

Cissé¹,

Abouchane²,

Anik³

et al. 2010

International Journal of Corrosion

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Electroless Ni-Cu-P alloy coatings were deposited on the ordinary steel substrate in an acidic hypophosphite-type plating bath. These coatings were characterized by a scanning electron microscope (SEM) and an X-ray diffraction. The micrograph shows that coating presents a nodular aspect and is relatively homogeneous and very smooth. The EDX analysis shows that the coating contains 12 wt.% of phosphorus element with a predominance of nickel element. In addition, the anticorrosion properties of the Ni-Cu-P coatings in 1 M HCl, 1 M H2SO4, and 3% NaCl solutions were investigated using Tafel polarization curves, electrochemical impedance spectroscopy, and SEM/EDX analysis. The result showed a marginal improvement in corrosion resistance in 3% NaCl solution compared to acidic medium. It also showed that the corrosion mechanism depends on the nature of the solution.

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“…The choice of these elements depends on the applications sought after. The applications of Ni-Cu-P in VLSI [7,8] and in thin-film memory discs [9] were considered.…”

Section: Introductionmentioning

confidence: 99%