Corrosion Resistance of Electroless Ni-Cu-P Ternary Alloy Coatings in Acidic and Neutral Corrosive Mediums

Abstract

Electroless Ni-Cu-P alloy coatings were deposited on the ordinary steel substrate in an acidic hypophosphite-type plating bath. These coatings were characterized by a scanning electron microscope (SEM) and an X-ray diffraction. The micrograph shows that coating presents a nodular aspect and is relatively homogeneous and very smooth. The EDX analysis shows that the coating contains 12 wt.% of phosphorus element with a predominance of nickel element. In addition, the anticorrosion properties of the Ni-Cu-P coatings in 1 M HCl, 1 M H2SO4, and 3% NaCl solutions were investigated using Tafel polarization curves, electrochemical impedance spectroscopy, and SEM/EDX analysis. The result showed a marginal improvement in corrosion resistance in 3% NaCl solution compared to acidic medium. It also showed that the corrosion mechanism depends on the nature of the solution.

Preparation and characterization of electroless Cu–P deposition protection for mild steel corrosion in molar hydrochloric solution

“…So, the protection efficiency is in the range from 12% to 80% without and with different concentration of NiSO 4 . The same results were obtained for the effect of Ni-Cu-P coating on the corrosion of mild steel in different medium (Cisse´et al, 2010;Fang et al, 2015). To confirm the results obtained by potentiodynamic polarization curves and study the inhibition mechanism with more detail, EIS was used.…”

“…It is found that the Ni-Cu-P deposit has the better corrosion resistance than Ni-P and copper deposits (Liu et al, 2015;Liu and Zhao, 2004), or stainless steel in alkaline 50% NaOH (Wang et al, 1992). In other study, it is shown that the mechanism protection of Ni-Cu-P deposit depended on the corrosive medium type (Cisse´et al, 2010).…”

Cu/Ni/Au multilayers by electrochemistry: A crucial system in electronics - A critical review

“…those that can be deposited individually and those that can be only codeposited. The former group consists of metals that are much nobler than Ni, like Ag [54][55][56][57] and Cu [58][59][60][61][62][63][64][65][66][67][68]; metals that have similar standard potentials, such as Co [69][70][71][72][73][74][75][76] and Sn [77][78][79][80][81][82][83][84][85]; and metals that are more cathodic, like Cr [86,87], Zn [88][89][90][91][92][93][94][95][96][97][98][99][100] and Mn [101]…”

An Experimental Approach for Optimizing Coating Parameters of Electroless Ni-P-Cu Coating Using Artificial Bee Colony Algorithm

“…Ternary Ni-P coatings, such as Ni-Cu-P [2, 3], Ni-W-P [4–8], Ni-P-PTFE [9, 10], Ni-P-SiC [11, 12], Ni-P-Al 2 O 3 [13, 14], and Ni-P-TiO 2 [15–17], have been investigated by different researchers. Among the ternary Ni-P alloy coatings, the electroless Ni-Cu-P alloy presents superior corrosion resistance and thermal conductivity than others [18–23]. But, only good corrosion resistant property is not sufficient for industrial purposes.…”