Research on a 3D Encapsulation Technique for Capacitive MEMS Sensors Based on Through Silicon Via

Zhang, Meng; Yang, Jian; He, Yurong; Yang, Fan; Yang, Fuhua; Han, Guowei; Si, Chaowei; Jin, Ning

doi:10.3390/s19010093

Cited by 23 publications

(32 citation statements)

References 21 publications

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“…Low-resistance silicon feedthroughs, consisting of the input and output ports (I/O ports), were designed to transmit the signals of the detectors with Pyrex glass acting as the insulation between the feedthroughs and the silicon substrate. Furthermore, a bonding ring made of Pyrex glass was designed in the packaging cap, which can be micro-fabricated together with vertical silicon vias by the glass reflow process [13][14][15]. The designed cap wafer can be wafer-level vacuum bonded to a device wafer through the anodic bonding between the Pyrex glass and silicon, without the need for additional solder [25].…”

Section: Structure Design and Discussionmentioning

confidence: 99%

“…The common bonding methods such as Cu-Sn bonding and Au-Sn bonding [11,12] are not cost-effective and easily cause large residue stress in the systems. The silicon wafer with inserted Pyrex glass is a promising 3D packaging structure, which utilizes vertical silicon feedthroughs to transmit electrical signals [13][14][15]. The inserted Pyrex glass acts as the electrical insulation and the anodic bonding material, which also has a matched TEC with silicon.…”

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confidence: 99%

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A Novel 3D Encapsulation Structure Based on Subwavelength Structure and Inserted Pyrex Glass for RF MEMS Infrared Detectors

Zhao

Song

et al. 2019

Electronics

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A novel wafer-level three-dimensional (3D) encapsulation structure was designed for radio-frequency microelectromechanical system (RF MEMS) infrared detectors and investigated by using the finite element method (FEM) simulation. A subwavelength structure with a circular array of coaxial apertures was designed to obtain an extraordinary optical transmission (EOT) on top of a silicon substrate. For perpendicular incident light, a maximum transmission of 56% can be achieved in the long-wave infrared (LWIR) region and the transmission bandwidth covered almost the full LWIR region. Moreover, the maximum transmission could be further promoted with an increase in the incident angle. The vertical silicon vias, insulated by inserted Pyrex glass, were used to generate electrical contacts. With the optimized structure parameters, a feed-through level lower than −82 dB, and a transmission coefficient of one single via of more than −0.032 dB were obtained at a frequency from 0 to 2 GHz, which contributed to the low-loss transmission of the RF signals. Due to the matched thermal expansion coefficients (TECs) between silicon and Pyrex glass, the proposed via structure has excellent thermal reliability. Moreover, its thermal stress is much less than that of a conventional through-silicon via (TSV) structure. These calculated results demonstrate that the proposed 3D encapsulation structure shows enormous potential in RF MEMS infrared detector applications.Electronics 2019, 8, 974 2 of 12 planar interconnect packaging [6][7][8][9][10][11]. There are two primary types of wafer-level 3D packaging. One is film encapsulation, which utilizes an epitaxial highly doped silicon film to seal devices and vertical silicon feedthroughs to transmit electrical signals [6,7]. Although the film encapsulation can contribute to the miniaturization of devices, its micro-fabrication process is very complicated. Another type is typically based on through-silicon vias (TSVs) and wafer-level bonding [8][9][10][11]. This technique utilizes TSVs to make vertical interconnections, which embed the vertical metal feedthroughs and SiO 2 films in bulk silicon to transmit electrical signals and act as the insulation, respectively. However, this technique has some shortcomings including mismatched thermal expansion coefficients (TECs) between the metal and silicon, large dielectric loss, insulation failure, a complex process, and high cost [9]. In addition, the wafer-level bonding between the cap and device wafers is critical to achieve long-term operation as well as high thermal insulation for RF MEMS infrared detectors. The common bonding methods such as Cu-Sn bonding and Au-Sn bonding [11,12] are not cost-effective and easily cause large residue stress in the systems. The silicon wafer with inserted Pyrex glass is a promising 3D packaging structure, which utilizes vertical silicon feedthroughs to transmit electrical signals [13][14][15]. The inserted Pyrex glass acts as the electrical insulation and the anodic bonding material, which also has a matched TEC wi...

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Section: Structure Design and Discussionmentioning

confidence: 99%

mentioning

confidence: 99%

A Novel 3D Encapsulation Structure Based on Subwavelength Structure and Inserted Pyrex Glass for RF MEMS Infrared Detectors

Zhao

Song

et al. 2019

Electronics

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“…A power-off experiment was performed to calculate the exact Q x . The specific experimental method was described in References [21,22]. Figure 5 shows the output of the drive mode over time after power-off.…”

Section: The Start-up Oscillation Process Of Mems Gyroscopesmentioning

confidence: 99%

“…The Q x factor is the embodiment of the system energy loss; therefore, the Q x factor can be calculated using the attenuation of the vibration amplitude. The formula for calculating the Q x factor value given in Zhang et al [21] is:…”

Section: The Start-up Oscillation Process Of Mems Gyroscopesmentioning

confidence: 99%

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The Characteristics and Locking Process of Nonlinear MEMS Gyroscopes

Han

et al. 2020

Micromachines

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With the miniaturization of micro-electro-mechanical system (MEMS) gyroscopes, it is necessary to study their nonlinearity. The phase-frequency characteristics, which affect the start-up time, are crucial for guaranteeing the gyroscopes’ applicability. Nevertheless, although the amplitude-frequency (A-f) effect, one of the most obvious problems in nonlinearity, has been well studied, the phase response of nonlinear gyroscopes is rarely mentioned. In this work, an elaborate study on the characteristics and locking process of nonlinear MEMS gyroscopes is reported. We solved the dynamic equation using the harmonic balance method and simulated the phase-locked loop (PLL) actuation process with an iterative calculation method. It was shown that there existed an apparent overhanging and multi-valued phenomenon in both the amplitude–frequency and phase–frequency curves of nonlinear gyroscopes. Meanwhile, it was ascertained by our simulations that the locking time of PLL was retarded by the nonlinearity under certain conditions. Moreover, experiments demonstrating the effect of nonlinearity were aggravated by the high quality factor of the drive mode due to the instability of the vibration amplitude. A nonlinear PLL (NPLL) containing an integrator was designed to accelerate the locking process. The results show that the start-up time was reduced by an order of magnitude when the appropriate integral coefficient was used.

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Research on a capacitive MEMS pressure sensor based on through glass via

Fu,

He,

Jia

et al. 2023

Micro & Optical Tech Letters

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The paper reports the fabrication and characterization of a capacitive Microelectro Mechanical Systems pressure sensor based on through glass vias (TGV), which had a large dynamic range by operating in touch mode. The substrate with TGV offers the advantage of elimination of parasitic capacitances owing to the superior insulation property of glass. The fabrication process was introduced. In particular, anodic bonding was applied in high vacuum to realize the hermetic package to obtain large operating range and high sensitivity. The performance of the sensor with a sensitive diaphragm of 700 μm × 1400 μm was characterized in the pressure range from −80 to 180 kPa. The sensitivity was determined as 0.072 pF/kPa over the range of 160 kPa with a good linearity of 97%.

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Research on a 3D Encapsulation Technique for Capacitive MEMS Sensors Based on Through Silicon Via

Cited by 23 publications

References 21 publications

A Novel 3D Encapsulation Structure Based on Subwavelength Structure and Inserted Pyrex Glass for RF MEMS Infrared Detectors

A Novel 3D Encapsulation Structure Based on Subwavelength Structure and Inserted Pyrex Glass for RF MEMS Infrared Detectors

The Characteristics and Locking Process of Nonlinear MEMS Gyroscopes

Research on a capacitive MEMS pressure sensor based on through glass via

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