Research on a capacitive MEMS pressure sensor based on through glass via
Yingchun Fu,
Fan He,
Lu Jia
et al.
Abstract:The paper reports the fabrication and characterization of a capacitive Microelectro Mechanical Systems pressure sensor based on through glass vias (TGV), which had a large dynamic range by operating in touch mode. The substrate with TGV offers the advantage of elimination of parasitic capacitances owing to the superior insulation property of glass. The fabrication process was introduced. In particular, anodic bonding was applied in high vacuum to realize the hermetic package to obtain large operating range and… Show more
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