2015
DOI: 10.1109/ted.2015.2446615
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PVT-Aware Design of Dopingless Dynamically Configurable Tunnel FET

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Cited by 69 publications
(29 citation statements)
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“…Furthermore, TFETs employing this technique do not require physical doping and hence, are known as doping less TFETs (DL TFETs) [13]. These devices have shown amazing benefits such as immunity towards RDFs and susceptibility towards parametric variations because of DL design [14]. Also, the DLTFET eliminates the requirement of high-temperature doping, expensive annealing techniques, and high thermal budgets for the creation of source and the drain regions in consequence of which the fabrication complexity of the TFET structure reduces.…”
Section: Introductionmentioning
confidence: 99%
“…Furthermore, TFETs employing this technique do not require physical doping and hence, are known as doping less TFETs (DL TFETs) [13]. These devices have shown amazing benefits such as immunity towards RDFs and susceptibility towards parametric variations because of DL design [14]. Also, the DLTFET eliminates the requirement of high-temperature doping, expensive annealing techniques, and high thermal budgets for the creation of source and the drain regions in consequence of which the fabrication complexity of the TFET structure reduces.…”
Section: Introductionmentioning
confidence: 99%
“…Moreover, to exploit full benefits of this concept, configurable BJT have also been built to exhibit switching between n-i-n to p-ip and vice versa [7] [8]. Hence, due to polarity control, problems associated with CP concept in BJT devices have now been resolved, and also have opened the integration possibility with other devices [9] [10] [11]. However, β of PC based devices are very poor compared to those devices that are based on CP concept.…”
Section: Introductionmentioning
confidence: 99%
“…By work-function engineering and present of N + layer at S/C region will improves ON state current, SS and threshold voltage (Vth), but JL-TFET also suffer from doping restrictions which are like RDFs and fabrication complexity. So, to solve these problems doping less TFET based on charge plasma (CP-TFET) [12][13][14][15] and electrically doped (ED-TFET) [16][17][18][19][20] ideas have been introduced. Both CP-TFET and ED-TFET provides low fabrication complexity and low-cost thermal budget.…”
Section: Introductionmentioning
confidence: 99%