Primary investigation of anodized aluminium as a substrate for hybrid microelectronics Part 2. Behaviour of thick film circuit components

Abstract

The relevant properties of anodized aluminium alloys as insulated metal substrates for hybrid microelectronic circuits are the high thermal conductivity of the metal base, the high heat emissivity and high mechanical strength of the anodic film, their low density and the low cost of manufacturing large circuits. The electrical and mechanical properties have been discussed in Part 1. The purpose of this paper is to describe the primary investigation of the behaviour of screen printed thick film circuit components on routinely prepared anodized aluminium alloy substrates.

Porous Alumina Films Fabricated by Reduced Temperature Sulfuric Acid Anodizing: Morphology, Composition and Volumetric Growth

“…The spontaneously emerging structure can be improved with the help of more [ 3 ] or less [ 4 , 5 ] complex techniques, which also make it possible to form PAFs with unusual morphology [ 6 ]. Thanks to its “technological plasticity” and the relative simplicity of formation, porous alumina is a promising material for a wide range of applications, such as an electronic product elemental base [ 7 , 8 , 9 , 10 , 11 ], or in various types of sensors and detectors [ 12 , 13 , 14 , 15 , 16 ]. A currently rapidly developing field is the creation of nanoscale structures and composite materials using porous anodic aluminum oxide as a highly ordered nanostructured matrix for the formation of various kinds of functional materials and devices [ 17 , 18 , 19 , 20 , 21 , 22 , 23 , 24 , 25 , 26 ], including nanostructures such as carbon nanotubes, nanodiamonds, and graphene [ 27 , 28 , 29 ].…”