Low cost wafer-level packaging method based on anodized aluminum substrate with backside signal pad and EMC passivation

Kim, Young-Joon; Han, Jun-Ho; Kim, Jung-Woo; Kwon, Young–Se

doi:10.1109/ectc.2010.5490756

2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) 2010

DOI: 10.1109/ectc.2010.5490756

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Low cost wafer-level packaging method based on anodized aluminum substrate with backside signal pad and EMC passivation

Young-Joon Kim

Jun-Ho Han

Jung-Woo Kim

et al.

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Low cost wafer-level packaging method based on anodized aluminum substrate with backside signal pad and EMC passivation

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References 8 publications

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