Predictive modeling of transition undeformed chip thickness in ductile-regime micro-machining of single crystal brittle materials

Effects of non-amorphizing hydrogen ion implantation on anisotropy in micro cutting of silicon

“…As for the fracture toughness, the decrease of brittle-period cutting forces indicates that the fracture toughness was reduced by ion implantation in both the two cutting directions. This is consistent with previous studies, which generally consider that pre-existing defects could cause decrease in the fracture toughness of brittle materials (Venkatachalam et al, 2009). Therefore, it is quite natural that the critical undeformed chip thickness in the <100> cutting direction would decrease after the non-amorphizing ion implantation, since the micro plasticity was unchanged and the fracture toughness was reduced.…”

Facet Preparation of Silicon Nano-Waveguides by Cleaving the Soi Chip

“…9 Furthermore, ultrashort laser pulses offer low scoring thresholds because of energy localization and the absence of plasma plume absorption. Energy is localized in a small depth mainly due to the reduction of light kerfs depth because of high laser intensities achieved with femtosecond pulses giving rise to a major contribution of multiphoton absorption processes.…”

Ductile grinding of Silicon carbide in high speed grinding

“…Later on, Bifano and Dow (1991) presented a ductile-brittle transition model in which the ductile grinding can be achieved under a certain critical chip thickness value. Venkatachalam et al (2009) proposed a fracture toughness based model to predict the ductile-brittle transitional undeformed chip thickness in end-turning of silicon wafer. However, all the above works are either in a relative lower machining speed or in micro-machining, high speed grinding in ductile grinding of brittle materials was not frequently reported.…”