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We present a micropump with a simple planar design featuring compliant in-contact check valves in a single layer, which allows for a simple structure and easy system integration. The micropump, based on poly(dimethylsiloxane) (PDMS), primarily consists of a pneumatically driven thin membrane, a pump chamber, and two in-plane check valves. The pair of check valves is based on an in-contact flap–stopper configuration and is able to minimize leakage flow, greatly enhancing the reliability and performance of the micropump. Systematic experimental characterization of the micropump has been performed in terms of the frequency response of the pumping flow rate with respect to factors including device geometry (e.g. chamber height) and operating parameters (e.g. pneumatic driving pressure and backpressure). The results demonstrate that this micropump is capable of reliably generating a maximum flow rate of 41 μL min−1 and operating against a high backpressure of up to 25 kPa. In addition, a lumped-parameter theoretical model for the planar micropump is also developed for accurate analysis of the device behavior. These results demonstrate the capability of this micropump for diverse applications in lab-on-a-chip systems.

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The ability to predict the critical depth for ductile-mode grinding of brittle materials is important to grinding process optimization and quality control. The traditional models for predicting the critical depth are mainly concerned with the material properties without considering the operation parameters. This article presents a new critical energy model for brittle–ductile transition by considering the strain rate effect brought by the grinding wheel speed and chip thickness. The experiments will be conducted through a high-speed diamond grinder on reaction-sintered silicon carbide materials under different grinding speed and chip thickness. Through detailed analysis of the strain rate effect on the dynamic fracture toughness, a new fracture toughness model will be established based on the Johnson–Holmquist material model (JH-2) and calibrated through experiments based on the indentation fracture mechanics. Then, the new critical model for brittle–ductile transition will be established by introducing the dynamic facture toughness model considering the wheel speed and chip thickness. According to scanning electron microscope observations, the results show that ductile-mode grinding can be obtained through a combination of higher grinding speed and smaller chip thickness. Moreover, the critical value for ductile grinding of brittle materials can be improved through the elevation of the grinding speed or reduction in the chip thickness.