Single-grit modeling and simulation of crack initiation and propagation in SiC grinding using maximum undeformed chip thickness

Zhu, Dahu; Yan, Shuicheng; Li, Beizhi

doi:10.1016/j.commatsci.2014.05.019

Cited by 94 publications

(23 citation statements)

References 26 publications

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“…However, the scale of model is usually below 100 nm to reduce the computation time of MD simulation, which is insufficient for modeling the grinding process. The FEM simulation has also been widely used for modeling the machining process of brittle materials [12][13][14][15][16][17][18] and it is a versatile and powerful tool for obtaining the approximate solutions. In the present study, the single-grit grinding simulation could be introduced for modeling the grinding process of brittle material shown in Fig.…”

Section: Numerical Simulation 31 Simulation Modelmentioning

confidence: 99%

“…Guo et al [13] developed a meshfree numerical simulation model for optical glass cutting based on smooth particle hydrodynamics (SPH) method. Single-grit simulation was utilized by Zhu et al [14] to investigate the initiation and propagation of individual cracks in SiC grinding under controllable M-UCT. Besides, the singlegrit simulation was also used to study the high-speed grinding mechanisms and the grinding surface topography respectively by Li et al [15] and Chakrabarti and Paul [16].…”

Section: Introductionmentioning

confidence: 99%

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Subsurface damage in high-speed grinding of brittle materials considering kinematic characteristics of the grinding process

Wang

Fang

Chen

et al. 2015

Int J Adv Manuf Technol

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Subsurface damage (SSD) induced during abrasive grain machining process strongly influences the mechanical strength and subsurface quality of the brittle components. Therefore, it is meaningful to study the relationship between SSD and grinding parameters. The methods of theoretical analysis, numerical simulation and experimental testing are used to analyze the SSD of brittle materials in high-speed grinding. The results of numerical simulation are consistent with those of theoretical analysis and experimental testing, which indicates that the present numerical method is reasonable. The investigation focuses on the effects of wheel speed, grinding depth, and apex angle of the abrasive grain on the SSD of brittle materials. It shows that when maximum undeformed chip thickness (M-UCT) is greater than the critical thickness of brittle fracture, the material removal is mainly in the brittle mode. A high wheel speed is beneficial to achieving a good subsurface quality. However, under certain conditions, an ultra-high wheel speed with quite small grinding depth is not helpful in SSD control. Due to the kinematic characteristics of the grinding process, the effect of grinding depth on SSD is weaker than that of wheel speed and a smaller abrasive grain is of advantage to subsurface quality. In addition, the grinding force is one of the major factors influencing the subsurface quality.

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Section: Numerical Simulation 31 Simulation Modelmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Subsurface damage in high-speed grinding of brittle materials considering kinematic characteristics of the grinding process

Wang

Fang

Chen

et al. 2015

Int J Adv Manuf Technol

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“…Some of the theoretical analyses associated with the formation of the chip and its parameters (undeformed chip thickness, relative chip volume, chip energy, chip temperature) is verified experimentally by researchers on the basis of the analysis of micromachining traces shaped using single abrasive grain (so-called scratch tests), for example in work of Brinksmeler and Glwerzew [19], or by grinding tests [20][21][22][23]. However, in the literature, examples of verification of theoretical calculations on the parameters determining the grinding process by microscopic observations of shaped chips morphology can also be found.…”

Section: Introductionmentioning

confidence: 99%

The effect of wear phenomena of grinding wheels with sol-gel alumina on chip formation during internal cylindrical plunge grinding of 100Cr6 steel

Nadolny

Kapłonek

2016

Int J Adv Manuf Technol

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The article presents the results of experimental investigations to determine the effect of wear phenomena of grinding wheels with sol-gel alumina abrasive grains on chip formation during internal cylindrical plunge grinding of 100Cr6 steel. Basic wear phenomena conducted during the grinding process using microcrystalline sintered corundum abrasives are described. In order to expand our knowledge of this phenomena, experimental tests were conducted in two stages. In stage 1, only one opening was machined, which corresponded to the removal of 464 mm 3 of workpiece material. In the second stage, the process was carried to machine 100 subsequent openings (material removal V w = 46, 400 mm 3). Such methodology allowed one to observe changes in the form of chips resulting from the progressive wear of the grinding wheel components. The form and size of the chips were identified by recording and analyzing the SEM micrographs of the chips for both grinding stages, respectively. Conducted studies have shown that the dominant type of chips, shaped in the initial period of the grinding wheel's life, are large (several hundred μm in length) flowing-type chips resulting from material removal by sharp cutting edges of abrasive grain active vertices. At the end of the grinding wheel's life, when active vertices of abrasive grains have clear signs of large fatigue and thermo-fatigue wear, only in the near-edge zones of the wheel can flowing-type and shearingtype chips (usually less than 100 μm in length) be observed, while knife-type and slice-type microchips were predominately registered on the whole grinding wheel surface.

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“…To solve this problem, transferring brittle to ductile mode removal is required for realizing mirror finish on the machined SiC surfaces. In a simulation study of single-grit diamond grinding of SiC, Zhu et al [6] found that once maximum undeformed chip thickness exceed 0.3 μm brittle fracture occurred and transverse cracks initiated. Xiao et al [7] performed molecular dynamic (MD) simulation study of diamond turning of 6H-SiC and proposed that the primary mechanism for the ductile deformation is Frank partial dislocations and basal plane edge dislocations.…”

Section: Introductionmentioning

confidence: 99%

Subsurface damages beneath fracture pits of reaction-bonded silicon carbide after ultra-precision grinding

Zhang

Luo

2018

Applied Surface Science

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This paper investigated the structural defects beneath the fracture area of 6H-SiC in reaction-bonded silicon carbide (RB-SiC) ceramics after ultra-precision grinding. The nano-indentation technique was used to evaluate the evolution of deformation behavior and find the critical transition condition among elastic, plastic and fracture. It was found that beneath the fracture pits, dislocations accompanied with micro-cracks (lateral and median) were the two types of subsurface damage. However, no amorphous phase was detected. In addition, a two-beam analysis confirmed that the dislocations were activated on basal and dissociated into the Shockley partial dislocations in 6H-SiC particle. The following indentation experiments revealed that the existence dislocations in the ground subsurface should be occurred earlier than cleavage. These dislocations were the predominant yielding mechanism in 6H-SiC, which initiated at a shear stress of about 23.4-28.4 Gpa through a pop-in event on load-displacement curve. Afterwards, cracks emerged when the maximum tensile stress beneath the indenter increased to 31.6 Gpa. It was identified that cracks could be activated under the intersection effect of non-uniform high density dislocations. Meanwhile, the blocking effect on sliding motion of dislocations caused by cross propagating dislocations, phase boundary and sintering agents play an important role in the evolution of fracture during grinding process. At last, the deformation behavior was further elaborated to discuss the slippage on the basal plane determined by Schmidt factor and structure characteristic of 6H-SiC.

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Single-grit modeling and simulation of crack initiation and propagation in SiC grinding using maximum undeformed chip thickness

Cited by 94 publications

References 26 publications

Subsurface damage in high-speed grinding of brittle materials considering kinematic characteristics of the grinding process

Subsurface damage in high-speed grinding of brittle materials considering kinematic characteristics of the grinding process

The effect of wear phenomena of grinding wheels with sol-gel alumina on chip formation during internal cylindrical plunge grinding of 100Cr6 steel

Subsurface damages beneath fracture pits of reaction-bonded silicon carbide after ultra-precision grinding

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