Study on high-speed grinding mechanisms for quality and process efficiency

Li, Beizhi; Ni, Jiaming; Yang, Jianguo; Liang, Steven Y.

doi:10.1007/s00170-013-5297-y

Cited by 50 publications

(26 citation statements)

References 13 publications

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“…However, due to its extremely high hardness, brittleness, and low fracture toughness, machining RB-SiC becomes a very challenging task. To obtain high form accuracy and surface integrity parts, grinding with diamond wheels is often employed to machine hard and brittle ceramics in various abrasive machining methods [3][4][5]. But some undesirable surface and subsurface damage such as micro cracks, pulverization layer induced by brittle fracture, and plastic deformation defects are easy to generate in the grinding process, which will impact the surface integrity and reduce the lifetime of the machined components [6].…”

Section: Introductionmentioning

confidence: 99%

Experimental investigation on the surface and subsurface damages characteristics and formation mechanisms in ultra-precision grinding of SiC

Zhang

et al. 2017

Int J Adv Manuf Technol

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Surface and subsurface damages appear inevitably in the grinding process, which will influence the performance and lifetime of the machined components. In this paper, ultraprecision grinding experiments were performed on reactionbonded silicon carbide (RB-SiC) ceramics to investigate surface and subsurface damages characteristics and formation mechanisms in atomic scale. The surface and subsurface damages were measured by a combination of scanning electron microscopy (SEM), atomic force microscopy (AFM), raman spectroscopy, and transmission electron microscope (TEM) techniques. Ductile-regime removal mode is achieved below critical cutting depth, exhibiting with obvious plow stripes and pile-up. The brittle fracture behavior is noticeably influenced by the microstructures of RB-SiC such as impurities, phase boundary, and grain boundary. It was found that subsurface damages in plastic zone mainly consist of stacking faults (SFs), twins, and limited dislocations. No amorphous structure can be observed in both 6H-SiC and Si particles in RB-SiC ceramics. Additionally, with the aid of high-resolution TEM analysis, SFs and twins were found within the 6H-SiC closed packed plane, i.e., (0001). At last, based on the SiC structure characteristic, the formation mechanisms of SFs and twins were discussed, and a schematic model was proposed to clarify the relationship between plastic deformation-induced defects and brittle fractures.

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Section: Introductionmentioning

confidence: 99%

Experimental investigation on the surface and subsurface damages characteristics and formation mechanisms in ultra-precision grinding of SiC

Zhang

et al. 2017

Int J Adv Manuf Technol

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“…In a high speed grinding process, an increased grinding speed can reduce the maximum grit depth of cut (or maximum undeformed chip thickness), and thus the grinding force [12][13][14]. The reduction in grinding force would help improve the ground surface quality.…”

Section: Page 3 Of 43mentioning

confidence: 99%

“…Under such conditions, plastic flow would become A c c e p t e d M a n u s c r i p t 28 predominant in the material removal and good surface integrity could be achieved in the grinding of brittle materials [6,[10][11][12]. In this study, the surface characteristics of the thin film multilayers being ground were examined using SEM.…”

Section: Grinding Characteristicsmentioning

confidence: 99%

A comparative study of conventional and high speed grinding characteristics of a thin film multilayer structure

Kang

Huang

2017

Precision Engineering

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Please cite this article as: Kang C, Huang H, A comparative study of conventional and high speed grinding characteristics of a thin film multilayer structure, Precision Engineering (2017), http://dx.doi.org/10. 1016/j.precisioneng.2017.05.010 This is a PDF file of an unedited manuscript that has been accepted for publication. As a service to our customers we are providing this early version of the manuscript. The manuscript will undergo copyediting, typesetting, and review of the resulting proof before it is published in its final form. Please note that during the production process errors may be discovered which could affect the content, and all legal disclaimers that apply to the journal pertain.

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“…On the other hand, the increased speed will cause the increase to obtain the higher material removal rate, wi and experiments, Li et al (2014) show that from the quasi-static condition under a lower grinding speed grinding of SiC is given in their work, a quantitative From the literature review above, it is clear that material removal in ductile plastic deformation whereas material removal in brittle paper is an attempt to provide more practical investigation for ductile grinding of SiC in high speed grinding. A comprehensive observation for ground surface, subsurface and grinding chips is analyzed to explain speed effect on SiC.…”

Section: Ductile Grinding Of Silicon Carbide In High Speed Grindingmentioning

confidence: 99%

Ductile grinding of Silicon carbide in high speed grinding

Pang

et al. 2016

JAMDSM

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Ductile grinding of brittle materials has been demonstrated in achieving desired machining quality without deteriorating surface and subsurface quality and any post processing work. However, it is still in a low efficiency in micro-machining or conventional grinding. In this paper, a high speed diamond grinder was exploited to explore ductile grinding of SiC at a relatively higher material removal. A combination of ground surface, subsurface and grinding chips SEM observations are given to explain the high speed grinding mechanism for SiC. This study indicates that ductile grinding of SiC can be achieved through a combination of the increase of the wheel speed and the control of grinding depth. Moreover, the critical chip thickness for ductile grinding of SiC can be greatly improved under a higher grinding speed comparing to conventional speed grinding. Correspondingly, the material removal volumes can be substantially enhanced in high speed grinding while not affecting subsurface and surface integrity.

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Study on high-speed grinding mechanisms for quality and process efficiency

Cited by 50 publications

References 13 publications

Experimental investigation on the surface and subsurface damages characteristics and formation mechanisms in ultra-precision grinding of SiC

Experimental investigation on the surface and subsurface damages characteristics and formation mechanisms in ultra-precision grinding of SiC

A comparative study of conventional and high speed grinding characteristics of a thin film multilayer structure

Ductile grinding of Silicon carbide in high speed grinding

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