Ductile grinding of Silicon carbide in high speed grinding

Wu, Chongjun; Li, Beizhi; Pang, Jingzhu; Liang, Steven Y.

doi:10.1299/jamdsm.2016jamdsm0020

Cited by 12 publications

(5 citation statements)

References 15 publications

(17 reference statements)

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“…The machined surfaces with DRM are usually damage-free with material accumulation due to plastic flow; and those with BRM show obvious brittle fracture. The results of the high-speed grinding of SiC depicted that the material removal gradually transitions from brittle to ductile modes with maximum undeformed chip thickness decreases, as shown in figure 1 [46].…”

Section: The Manufacturing Processes With Extremely Small Scalementioning

confidence: 95%

Towards understanding the brittle–ductile transition in the extreme manufacturing

Zhang

Jiang

Huang

et al. 2021

Int. J. Extrem. Manuf.

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The brittle–ductile transition (BDT) widely exists in the manufacturing with extremely small deformation scale, thermally assisted machining, and high-speed machining. This paper reviews the BDT in extreme manufacturing. The factors affecting the BDT in extreme manufacturing are analyzed, including the deformation scale and deformation temperature induced brittle-to-ductile transition, and the reverse transition induced by grain size and strain rate. A discussion is arranged to explore the mechanisms of BDT and how to improve the machinability based on the BDT. It is proposed that the mutual transition between brittleness and ductility results from the competition between the occurrence of plastic deformation and the propagation of cracks. The brittleness or ductility of machined material should benefit a specific manufacturing process, which can be regulated by the deformation scale, deformation temperature and machining speed.

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Section: The Manufacturing Processes With Extremely Small Scalementioning

confidence: 95%

Towards understanding the brittle–ductile transition in the extreme manufacturing

Zhang

Jiang

Huang

et al. 2021

Int. J. Extrem. Manuf.

View full text Add to dashboard Cite

show abstract

“…This observation is consistent with the results of other researchers. 42,44,50 It is worth noting that when the cutting tool moves to the grain boundary, except for the model with 0°g rain boundary inclination, the tangential and normal forces of other inclined grain boundary models are reduced to a certain extent. When the cutting tool passes through the grain boundary, it returns to its original position, which makes the curve of cutting force form a ''V'' shape at the grain boundary.…”

Section: Effect Of Grain Boundary Anglementioning

confidence: 99%

Atomistic study of nano-cutting bicrystal cubic silicon carbide

Dai

2022

Proceedings of the Institution of Mechanical Engineers, Part C:

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To solve problems of low machining efficiency and surface/subsurface damage of silicon carbide (SiC), mechanisms of material dislodging and subsurface destruction of bicrystal SiC under nano-cutting were studied by using three-dimensional molecular dynamics (MD) simulation method. Effects of grain boundary (GB) tilt angle and cutting speed on stress, hydrostatic pressure, cutting force, temperature, and subsurface damage depth were analyzed. Results show that GB slope angle has important influence on the spread of strain, hydrostatic stress, and temperature, especially on subsurface damage depth. Specifically, with the increase in GB slope angle, subsurface damage layer decreases, and machined surface morphology improves. The machinability of small GB angle is better than the large GB angle, and the model with grain boundary angle of 4.24° has the best machinability. It is also found that with the increase in cutting velocity, the temperature increases, whereas cutting force and friction coefficient are reduced, which indicates that the increase in cutting velocity can effectively improve surface machined morphology. The research results provide a theoretical reference for future experimental research.

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“…E, H V and K 1C are, respectively, the elastic modulus, the hardness and fracture toughness. The maximum undeformed chip thickness is written as follows (Wu et al, 2016):…”

Section: Grit Scratching Mechanismmentioning

confidence: 99%

Ductile grinding of Silicon carbide in high speed grinding

Cited by 12 publications

References 15 publications

Towards understanding the brittle–ductile transition in the extreme manufacturing

Towards understanding the brittle–ductile transition in the extreme manufacturing

Atomistic study of nano-cutting bicrystal cubic silicon carbide

High speed toughening-based ceramics grinding mechanism for quality and efficiency

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