Effects of non-amorphizing hydrogen ion implantation on anisotropy in micro cutting of silicon

Xiao, Gao; To, Suet; Jelenković, Emil V.

doi:10.1016/j.jmatprotec.2015.06.017

Cited by 51 publications

(20 citation statements)

References 35 publications

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“…The transitional range of undeformed chip thickness explains why scattered tiny craters existed between the ductile-cut and brittle-cut regions in many studies [16,20,21]. It reveals that these scattered craters could occur even if there are no disturbances like pre-existing defects, local unevenness, vibrations in machining system, etc.…”

Section: Experimental Validationmentioning

confidence: 97%

“…While the concept of critical undeformed chip thickness has been widely acknowledged and applied to guide the ultra-precision machining of brittle materials [18,19], the cutting mode transition process around this critical value is not yet physically clear due to the lack of experimental approaches capable of observing the nanoscale cutting process in real time. A number of studies have reported that there exists a zone containing both brittle and ductile cutting behaviors between the pure ductile and brittle regions [16,20,21], but the mechanism is not yet clear. It has been suggested that this may be caused by pre-existing defects [22], or local unevenness of material properties [23], but in-depth investigations are still missing.…”

Section: Introductionmentioning

confidence: 99%

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Mechanism of Unstable Material Removal Modes in Micro Cutting of Silicon Carbide

2019

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This study conducts large-scale molecular dynamics (MD) simulations of micro cutting of single crystal 6H silicon carbide (SiC) with up to 19 million atoms to investigate the mechanism of unstable material removal modes within the transitional range of undeformed chip thickness in which either brittle or ductile mode of cutting might occur. Under this transitional range, cracks are always formed in the cutting zone, but the stress states cannot guarantee their propagation. The cutting mode is brittle when the cracks can propagate and otherwise ductile mode cutting happens. Plunge cutting experiment is conducted to produce a taper groove on a 6H SiC wafer. There is a transitional zone between the brittle-cut and ductile-cut regions, which has a mostly smooth surface with a few brittle craters on it. This study contributes to the understanding of the detailed process of brittle-ductile cutting mode transition (BDCMT) as it shows that a transitional range can occur even for single crystals without internal defects and provides guidance for the determination of tcritical from taper grooves made by various techniques, e.g., to adopt larger tcritical around the end of the transitional range to increase machining efficiency for grinding or turning as long as the cracks do not extend below the machined surface.

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Section: Experimental Validationmentioning

confidence: 97%

Section: Introductionmentioning

confidence: 99%

Mechanism of Unstable Material Removal Modes in Micro Cutting of Silicon Carbide

2019

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“…After a taper-cutting experiment is completed, it is necessary to characterize the tapered surface of the material in order to calculate the BDTD under the current cutting conditions. Currently, two-dimensional image calculation methods or three-dimensional microscopic observation methods are generally used for characterization [ 16 , 17 , 18 ]. Two-dimensional image processing calculation methods use the geometric relationship between the tool and the chute, judge the position of the brittle-ductile transition according to the changes in the material’s surface, and then calculate the BDTD.…”

Section: Introductionmentioning

confidence: 99%

A Self-Established “Machining-Measurement-Evaluation” Integrated Platform for Taper Cutting Experiments and Applications

Yang

Zhu

et al. 2021

Micromachines

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Taper-cutting experiments are important means of exploring the nano-cutting mechanisms of hard and brittle materials. Under current cutting conditions, the brittle-ductile transition depth (BDTD) of a material can be obtained through a taper-cutting experiment. However, taper-cutting experiments mostly rely on ultra-precision machining tools, which have a low efficiency and high cost, and it is thus difficult to realize in situ measurements. For taper-cut surfaces, three-dimensional microscopy and two-dimensional image calculation methods are generally used to obtain the BDTDs of materials, which have a great degree of subjectivity, leading to low accuracy. In this paper, an integrated system-processing platform is designed and established in order to realize the processing, measurement, and evaluation of taper-cutting experiments on hard and brittle materials. A spectral confocal sensor is introduced to assist in the assembly and adjustment of the workpiece. This system can directly perform taper-cutting experiments rather than using ultra-precision machining tools, and a small white light interference sensor is integrated for in situ measurement of the three-dimensional topography of the cutting surface. A method for the calculation of BDTD is proposed in order to accurately obtain the BDTDs of materials based on three-dimensional data that are supplemented by two-dimensional images. The results show that the cutting effects of the integrated platform on taper cutting have a strong agreement with the effects of ultra-precision machining tools, thus proving the stability and reliability of the integrated platform. The two-dimensional image measurement results show that the proposed measurement method is accurate and feasible. Finally, microstructure arrays were fabricated on the integrated platform as a typical case of a high-precision application.

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“…As the critical DoC is an important factor related to the surface uniformity and machining efficiency, a variety of methods have been proposed to increase the critical DoC of infrared materials, such as vibration-assisted cutting [22], laser-assisted cutting [23] and ion implantation modification [24]. With the assistance of the extra energy, vibration-assisted and laser-assisted cutting have been demonstrated to be effective to improve the machinability of infrared materials by enhancing its plastic deformation, thereby suppressing brittle fractures even under slightly higher cutting depths.…”

Section: Introductionmentioning

confidence: 99%

Development of self-tuned diamond milling system for fabricating infrared micro-optics arrays with enhanced surface uniformity and machining efficiency

Sun¹,

To²,

Wang³

et al. 2020

Opt. Express

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Infrared micro-optics arrays (MOAs) featuring large numbers of micro-freeform lenslet are required increasingly in advanced infrared optical systems. Ultra-precision diamond cutting technologies have been widely used to fabricate MOAs with high form accuracy. However, the existing technologies can easily cause the non-uniformly fractured surface of infrared MOAs, due to the inherent low fracture toughness and high anisotropy of infrared materials as well as the time-varying chip thickness induced by ever-changing height and slope of the desired MOAs. In this study, a novel self-tuned diamond milling (STDM) system is proposed to achieve the ductile cutting of infrared MOAs with enhanced the surface uniformity and machining efficiency, and the corresponding toolpath planning algorithm is developed. In STDM system, a dual-axial fast servo motion platform is integrated into a raster milling system to self-adaptively match the maximum chip thickness for each tool rotational cycle with the critical depth of cut of the infrared material according to the local surface topography, thereby obtaining crack-free lenslet with high surface uniformity. Practically, micro-aspheric MOAs free from fractures are successfully machined on single-crystal silicon, a typical infrared material, to validate the proposed cutting concept. Compared with the conventional diamond milling, the proposed STDM is demonstrated to be able to avoid the non-uniform fractures without needing to reduce feed rate, and a smaller surface roughness of 4 nm and nearly double machining efficiency are achieved.

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Effects of non-amorphizing hydrogen ion implantation on anisotropy in micro cutting of silicon

Cited by 51 publications

References 35 publications

Mechanism of Unstable Material Removal Modes in Micro Cutting of Silicon Carbide

Mechanism of Unstable Material Removal Modes in Micro Cutting of Silicon Carbide

A Self-Established “Machining-Measurement-Evaluation” Integrated Platform for Taper Cutting Experiments and Applications

Development of self-tuned diamond milling system for fabricating infrared micro-optics arrays with enhanced surface uniformity and machining efficiency

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