Facet Preparation of Silicon Nano-Waveguides by Cleaving the Soi Chip

Abstract

<jats:p>Optical facet preparation of silicon-on-insulator (SOI) waveguides was done by polishing after saw dicing or cleaving after two different techniques of scoring by a mechanical saw and fs-laser. Cleaving after fs-laser scoring leads to smooth facet surface of air covered SOI waveguides; polishing after dicing is more efficient with SiO<jats:sub>2</jats:sub>covered waveguides. The prepared end facets were investigated using an atomic force microscope (AFM) and scanning electron microscopy (SEM). The SOI waveguides were characterized by optical transmission of telecommunication wavelength (1.5 μm).</jats:p>

Grating-assisted coupling to nanophotonic circuits in microcrystalline diamond thin films

“…While traditional butt-coupling using optical fibres aligned to cleaved facets of photonic chips is commonly employed [25], such an approach requires careful positioning of the input–output fibres with respect to the waveguide, which is time consuming and not suitable for the investigation of large numbers of devices. Therefore, we employ an alternative approach using grating couplers, which scatter light propagating inside the diamond waveguide out of plane [26].…”