Power distribution networks for system-on-package: status and challenges

Swaminathan, Madhavan; Kim, Joungho; Novak, Istvan; Libous, J.

doi:10.1109/tadvp.2004.831897

Cited by 229 publications

(75 citation statements)

References 44 publications

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“…To maintain the signal integrity, the power and ground planes are required to be continuous layouts for the direct current. High superficial resistivity on these planes is expected to efficiently filter out the alternating noise [1,4]. Dimensionally much smaller than the wavelength, the cell of the EBG structure functions as a band-stop filter and is recognized as a parallel resonant circuit quantified by the capacitance C and inductance L. Both parameters are determined by the geometry of the metal patch and the bridge: the gap between neighboring patches provides C, whereas L is introduced by the bridge.…”

Section: Ms-ebg Structurementioning

confidence: 99%

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Design and Analysis of a Novel Electromagnetic Bandgap Structure for Suppressing Simultaneous Switching Noise

Lü¹,

Zhao²,

Zhang³

2012

PIER C

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Abstract-An electromagnetic bandgap (EBG) structure is proposed to suppress the simultaneous switching noise (SSN) from 0.45 GHz to 5.3 GHz with an averaged suppression level of −66.4 dB. The design is based on the inductance enhancement by using meander lines to bridge slotted metal patches embedded into the power plane. Numerical simulation and experimental measurement are both used in the study for mutual verification. Compared to the conventional L-bridged EBG structure, the novel design increases the bandwidth by 15% and reduces the lower frequency by 150 MHz. A better omnidirectional SSN suppression is also achieved. For high-speed digital applications, the signal integrity is analyzed and improved.

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Section: Ms-ebg Structurementioning

confidence: 99%

“…Simultaneous switching noise (SSN) is a bottleneck in the application of modern high-speed digital circuits with fast edge rates and clock frequencies [1]. SSN reduces the noise margin and undermines the performance of analog circuits in the system with mixed signals.…”

Section: Introductionmentioning

confidence: 99%

Design and Analysis of a Novel Electromagnetic Bandgap Structure for Suppressing Simultaneous Switching Noise

Lü¹,

Zhao²,

Zhang³

2012

PIER C

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“…In this type of mixed-mode system, however, the simultaneous switching noise (SSN) caused by high-speed digital circuits not only affects digital functionality but also degrades the receiver sensitivity and reliability of neighboring analog and RF circuits [1], [2].…”

Section: ⅰ Introductionmentioning

confidence: 99%

Modeling of an On-Chip Power/Ground Meshed Plane Using Frequency Dependent Parameters

Hwang¹,

Kim²,

Pak³

et al. 2011

Journal of electromagnetic engineering and science

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This paper proposes a new modeling method for estimating the impedance of an on-chip power/ground meshed plane. Frequency dependent R, L, and C parameters are extracted based on the proposed method so that the model can be applied from DC to high frequencies. The meshed plane model is composed of two parts: coplanar multi strip (CMS) and conductor-backed CMS. The conformal mapping technique and the scaled conductivity concept are used for accurate modeling of the CMS. The developed microstrip approach is applied to model the conductor-backed CMS. The proposed modeling method has been successfully verified by comparing the impedance of RLC circuit based on extracted parameters and the simulated impedance using a 3D-field solver. Ⅰ. IntroductionRecently, communication, computing, and sensing systems have incorporated noise-sensitive analog RF circuits, and noisy digital circuits into a single chip/package for small form factors and high performance. In this type of mixed-mode system, however, the simultaneous switching noise (SSN) caused by high-speed digital circuits not only affects digital functionality but also degrades the receiver sensitivity and reliability of neighboring analog and RF circuits [1], [2].The amount of SSN is determined by the amount of current consumption of the circuits and the impedance profile of the power distribution network (PDN) seen from the circuits. An efficient way to reduce the amount of SSN is to design a PDN that has low impedance at the switching frequency and its harmonics. Therefore, estimation of the impedance properties of the PDN is important for the reliable operation of the system. As the operating frequency exceeds GHz levels, the highfrequency performance of the PDN should also be taken into consideration.For on-chip PDNs in high-speed systems, a meshed plane, as shown in Fig. 1, has been widely adopted because of its low inductance. The on-chip power/ground meshed plane has been extensively analyzed [3]～ [5]. However, it is difficult to apply previous works to meshed planes that are fabricated with standard CMOS processes because they are not compatible with the SPICE Fig. 1. Conventional on-chip power/ground meshed plane composed of two metal layers.simulator [3]. They are also not suitable for a standard CMOS process because of the vertical configurations; the metal thickness and the dielectric layer stack-up are different. Consequently, the applicable frequency range of the works is limited to a very narrow frequency range in a standard CMOS process [4], [5]. This paper provides details about the modeling of an on-chip meshed plane on low-resistivity silicon substrates. Quasi-static analysis using conformal mapping and the scaled conductivity concept are applied to calculate the frequency dependent parameters of the coplanar multi strip (CMS) structure. For a conductor-backed CMS, the developed microstrip approaches are simplified to suit the physical dimensions of the targeted structure and are applied to extract parameters. The impedance profiles of the...

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“…It has been highly desired to prevent problems in the early stages of design and packaging of electronic components [1,2,3]. Applying an electromagnetic near-field probe is considered very effective to meeting this need because the information so acquired can be used to make a good electrical design [4].…”

Section: Introductionmentioning

confidence: 99%

Ultra small electro-optic field probe fabricated by aerosol deposition

Iwanami

Nakada

Tsuda

et al. 2007

IEICE Electron. Express

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Abstract:We developed a microscopic electro-optic field probe by directly depositing a lead zirconate-titanate [PbZr 0.3 Ti 0.7 O 3 ] film onto the optical fiber edge using aerosol deposition. Its fabrication process is low-cost and relatively easy because there are no complicated procedures such as fine lithography and etching. The lateral size of the film is 125 µm, which is the same as the diameter of a typical single mode fiber, and the thickness is approximately 5 µm. An RF electro-optic signal was successfully measured over a microstrip line. The capability for detecting GHz range fields is also shown. Because it is very tiny and thin, the developed electro-optic probe has great potential for detailed electrical characterization in the microscopic regions of high performance electronic products such as the interconnecting parts between LSI packages and printed circuit boards and spaces among different LSI chips in a package. Keywords: fiber-edge electro-optic probe, aerosol deposition, lead zirconate-titanate film Classification: Photonics devices, circuits, and systems References[1] F. Caignet, S. Delmas-Bendhia, and E. Sicard, "The Challenge of Signal Integrity in Deep-Submicrometer CMOS Technology," Proc. IEEE, vol. 89, no. 4, pp. 556-573, 2001. Tech., vol. 48, no. 12, pp. 2611Tech., vol. 48, no. 12, pp. -2616Tech., vol. 48, no. 12, pp. , 2000 T. Ohara, R. Namiki, K. Igarashi, S. Wakana, and M. Tsuchiya, "Proposal of electro-optic sensor head attached to optical fiber edge," IEICE Technical Report, OPE99-22, pp. 55-60, 1999 (in Japanese

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Power distribution networks for system-on-package: status and challenges

Cited by 229 publications

References 44 publications

Design and Analysis of a Novel Electromagnetic Bandgap Structure for Suppressing Simultaneous Switching Noise

Design and Analysis of a Novel Electromagnetic Bandgap Structure for Suppressing Simultaneous Switching Noise

Modeling of an On-Chip Power/Ground Meshed Plane Using Frequency Dependent Parameters

Ultra small electro-optic field probe fabricated by aerosol deposition

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