Perhydropolysilazane spin-on dielectrics for inter-layer-dielectric applications of sub-30 nm silicon technology

Abstract

Various material properties of the perhydropolysilazane spin-on dielectric (PHPS SOD) were examined and analyzed in this study as potential inter-layer dielectrics (ILDs) integrated for Si circuits of 30 nm technology or beyond. The spin-coated PHPS (18.5 wt%) layers converted at 650 • C showed comparable but less perfect thermal conversion to silica than the films converted at 1000 • C, however exhibiting excellent gap filling (15 nm gap opening, aspect ratio (AR) of ∼23) and planarization (degree of planarization (DOP) = ∼73% for 800 nm initial step height, cusp angle = ∼16 • ) sufficient for the Si integration. PHPS SOD layers cured at 650 • C were integrated ILDs in the 0.18 μm Si front-end-of-the-line process, and the estimated hot-carrier reliability of n-channel metal oxide semiconductor transistors (ten years at a drain voltage of 1.68 V) had no significant difference from that of the transistors integrated with the conventional borophosposilicate glass ILDs. A modified contact pre-cleaning scheme using N 2 O plasma treatment also produced uniform and stable contact chain resistances from the SOD ILDs.

Optimization of a Solution-Processed SiO2 Gate Insulator by Plasma Treatment for Zinc Oxide Thin Film Transistors

“…Infrared spectra are shown in Figure while Table provides the IR peak assignments. ,− It has previously been shown that, above 300 °C, the hydrolysis of Si–N and Si–H bonds leads to the formation of a SiO 2 network. ,, In the case of CAPS, the main absorption bands are observed at approximately 1180 and 3360 cm –1 and correspond to the bend and stretch modes of N–H, respectively. In addition, bands at 920, 840, and 2160 cm –1 indicate the presence of Si–N and Si–H bonds in the CAPS film.…”

Evaluation of mechanical properties and hydrophobicity of room‐temperature, moisture‐curable polysilazane coatings

“…6 Polysilazane coatings can be transformed into SiCO, SiCN, or Si 3 N 4 ceramic coatings by pyrolyzing at high temperatures in air, N 2 , or Ar atmosphere. [7][8][9] They are promising candidates for inter-layer dielectrics, 10 oxidation, or wear protection coatings 11,12 for high-temperature applications because of their good thermal shock resistance and thermal stability. However, the high-temperature applications require processing temperatures beyond 800 C, which is impracticable for certain applications owing to the limitation of the substrate or manufacturing process.…”

Process Parameter Optimization of a Polymer Derived Ceramic Coatings for Producing Ultra-High Gas Barrier

“…This treatment yielded a polysilazane with high molecular weight. Completely cured polysilazane remains optically clear and transparent yielding a very smooth surface [30][31][32][33]. For complete transformation of polysilazane to silica, different methods are being used that include: curing with heat, exposing to a catalyst, curing by irradiating with deep UV and a combination of the aforementioned methods [24,33].…”