2013
DOI: 10.1117/1.jmm.12.3.033010
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Performance of negative tone chemically amplified fullerene resists in extreme ultraviolet lithography

Abstract: Abstract. With extreme ultraviolet lithography (EUVL) emerging as one of the top contenders to succeed from optical lithography for the production of next generation semiconductor devices, the search for suitable resists that combine high resolution, low line edge roughness (LER) and commercially viable sensitivity for high volume production is still ongoing. One promising approach to achieve these goals has been the development of molecular resists. Here we report our investigations into the EUV lithographic … Show more

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Cited by 10 publications
(6 citation statements)
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“…The crosslinking reaction mechanism of the tBOC protected material IM-MFPT12-2 is still under investigation, but we speculate a two-step reaction in which the tBOC protection group is rst removed catalytically by the PAG generated acid, leaving a phenol, which then crosslinks cationically with the epoxy. 38,41 The additional deprotection step might result in the lower sensitivity and higher contrast of IM-MFPT12-2 compared with IM-MFP12-3.…”
Section: Sensitivity and Contrast Evaluationmentioning
confidence: 99%
“…The crosslinking reaction mechanism of the tBOC protected material IM-MFPT12-2 is still under investigation, but we speculate a two-step reaction in which the tBOC protection group is rst removed catalytically by the PAG generated acid, leaving a phenol, which then crosslinks cationically with the epoxy. 38,41 The additional deprotection step might result in the lower sensitivity and higher contrast of IM-MFPT12-2 compared with IM-MFP12-3.…”
Section: Sensitivity and Contrast Evaluationmentioning
confidence: 99%
“…The synthetic route is similar to that previously described for the fullerene resist [6] but the addition of the fullerene material is omitted during the process.…”
Section: Resultsmentioning
confidence: 99%
“…In the course of our work on molecular fullerene resists for EUVL we isolated a new resist molecule that enables sub-16 nm patterning, herein referred to as xMT. The synthetic route is similar to that previously described for the fullerene resist [6] but the addition of the fullerene material is omitted during the process.…”
Section: Resultsmentioning
confidence: 99%