2005
DOI: 10.1109/ted.2005.844760
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Optimization of Embedded Compact Nonvolatile Memories for Sub-100-nm CMOS Generations

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Cited by 6 publications
(2 citation statements)
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“…Split-gate flash memory has been widely studied for embedded memory applications thanks to its high programming efficiency, low power consumption and immunity to over-erase problem. [1][2][3][4][5][6][7][8][9][10][11] Source-side injection (SSI) of hot electrons is most commonly utilized to program the cell because both high lateral and vertical field are obtained in the gap region with proper bias. 1) The charge-storage layer of split-gate memory can be floating poly, nitride 9) or nanocrystal.…”
Section: Introductionmentioning
confidence: 99%
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“…Split-gate flash memory has been widely studied for embedded memory applications thanks to its high programming efficiency, low power consumption and immunity to over-erase problem. [1][2][3][4][5][6][7][8][9][10][11] Source-side injection (SSI) of hot electrons is most commonly utilized to program the cell because both high lateral and vertical field are obtained in the gap region with proper bias. 1) The charge-storage layer of split-gate memory can be floating poly, nitride 9) or nanocrystal.…”
Section: Introductionmentioning
confidence: 99%
“…1) The charge-storage layer of split-gate memory can be floating poly, nitride 9) or nanocrystal. 11) For split-gate memory cell with floating poly, it can be erased by uniform channel Fowler-Nordheim (FN) erase, 3) source-junction-side FN erase, 2) or poly-topoly FN erase. 5) In ref.…”
Section: Introductionmentioning
confidence: 99%