2016
DOI: 10.5194/jsss-5-197-2016
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Offset stable piezoresistive high-temperature pressure sensors based on silicon

Abstract: Abstract. The exploitation of new application fields and the drive to size reduction even in highly stable pressure sensing systems makes the extension of the operating temperature range of the microelectromechanical sensors (MEMS) essential. For this reason a silicon-based pressure sensor with an application temperature ranging up to 300 • C and the associated manufacturing technology was developed. With special design and manufacturing approaches mounting stress-insensitive sensors with high linearity, excel… Show more

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Cited by 4 publications
(1 citation statement)
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“…The glass frit bonded sensor assembly undergoes high strain with temperature variations due to the large CTE mismatch between the silicon and the glass frit and steel diaphragm [25,26]. They also suffer from the relaxation process in the glass leading to shift and hysteresis of zero offset at elevated temperature [38]. The stability and hysteresis of the zero offset as well as the sensitivity were tested after different temperature cycles.…”
Section: Discussionmentioning
confidence: 99%
“…The glass frit bonded sensor assembly undergoes high strain with temperature variations due to the large CTE mismatch between the silicon and the glass frit and steel diaphragm [25,26]. They also suffer from the relaxation process in the glass leading to shift and hysteresis of zero offset at elevated temperature [38]. The stability and hysteresis of the zero offset as well as the sensitivity were tested after different temperature cycles.…”
Section: Discussionmentioning
confidence: 99%