2017
DOI: 10.1016/j.solmat.2017.06.041
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Multiple pathways for permanent deactivation of boron-oxygen defects in p-type silicon

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Cited by 27 publications
(19 citation statements)
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References 31 publications
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“…These trends in degradation behaviour with firing temperature and cooling rate correlate well with the present study. In contrast to LeTID, an increase in peak firing temperature and cooling rate is known to decrease the magnitude of BO-LID, 33,34 which is opposite to the trend observed here. However, an increase in non-BO related LID has been observed in Cz silicon at peak firing temperatures above $650 C. 33,35 While such effects have been attributed to LeTID, 36,37 the possibility of Cu-LID being responsible for such LID effects has not been specifically precluded in such studies.…”
Section: à3contrasting
confidence: 99%
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“…These trends in degradation behaviour with firing temperature and cooling rate correlate well with the present study. In contrast to LeTID, an increase in peak firing temperature and cooling rate is known to decrease the magnitude of BO-LID, 33,34 which is opposite to the trend observed here. However, an increase in non-BO related LID has been observed in Cz silicon at peak firing temperatures above $650 C. 33,35 While such effects have been attributed to LeTID, 36,37 the possibility of Cu-LID being responsible for such LID effects has not been specifically precluded in such studies.…”
Section: à3contrasting
confidence: 99%
“…In contrast to LeTID, an increase in peak firing temperature and cooling rate is known to decrease the magnitude of BO-LID, 33,34 which is opposite to the trend observed here. However, an increase in non-BO related LID has been observed in Cz silicon at peak firing temperatures above $650 C. 33,35 While such effects have been attributed to LeTID, 36,37 the possibility of Cu-LID being responsible for such LID effects has not been specifically precluded in such studies. It must be noted that there exist other empirical differences between LeTID and Cu-LID (e.g., SRH properties 29,38,39 and activation energy of degradation 31,38 ).…”
Section: à3contrasting
confidence: 99%
“…It appears that the rapid cool down from the high temperature plays a critical role in determining the defect concentration [75,78], possibly through a reduction in [O i ] [79]. This influence is supported by recent studies, which have shown that the fast-firing process used for the metallisation of industrial silicon solar cells can lead to a permanent reduction in the B-O defect concentration [73,[80][81][82]. Extended anneals at lower temperatures in the range of 400-700 • C can also reduce the B-O defect concentration probably through a reduction in the concentration of interstitial oxygen dimers [78,79]; however, extended annealing at sub-optimal conditions can also lead to an increase in the B-O defect concentration [72].…”
Section: Thermal Processingmentioning
confidence: 83%
“…Thermal processing can reduce the extent of B-O related degradation by reducing the concentration of the B-O defect and precursors [72,73]. For example, high-temperature processes such as phosphorus diffusion, thermal oxidation and annealing can reduce the B-O defect concentration and therefore increase the stable excess carrier lifetime of the silicon [8,13,[74][75][76][77].…”
Section: Thermal Processingmentioning
confidence: 99%
“…Furthermore, a dual role of the firing process has been recently identified with the thermal elimination of defect precursors, as well as modulating the hydrogen concentration in the silicon, which leads to a change in the rate of passivation. [107] A significant challenge for industrial boron-doped Czochralski silicon solar cells has been how to incorporate an effective illuminated annealing process into the production environment, with a throughput of 3600 wafers h À1 . Early work required minutes to hours for the complete elimination of B-Orelated degradation.…”
Section: Hydrogenation Of Carrier-induced Defectsmentioning
confidence: 99%