This is an open access article under the terms of the Creative Commons Attribution License, which permits use, distribution and reproduction in any medium, provided the original work is properly cited.Silicon wafer solar cells continue to be the leading photovoltaic technology, and in many places are now providing a substantial portion of electricity generation. Further adoption of this technology will require processing that minimises losses in device performance. A fundamental mechanism for efficiency loss is the recombination of photo-generated charge carriers at the unavoidable cell surfaces. Dielectric coatings have been shown to largely prevent these losses through a combination of different passivation mechanisms. This review aims to provide an overview of the dielectric passivation coatings developed in the past two decades using a standardised methodology to characterise the metrics of surface recombination across all techniques and materials. The efficacy of a large set of materials and methods has been evaluated using such metrics and a discussion on the current state and prospects for further surface passivation improvements is provided.

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In this work, we demonstrate a form of minority carrier degradation on ntype Cz silicon that affects both the bulk and surface related lifetimes. We identify three key behaviors of the degradation mechanism; 1) a firing dependence of degradation extent, 2) the appearance of bulk degradation when wafers are fired in the presence of a diffused emitter and 3) a firing related apparent surface degradation when wafers are fired in the absence of an emitter. We further report a defect capture cross-section ratio of σn/σp = 0.028 ± 0.003 for the defect in n-type. Utilizing our understanding of LeTID in p-type silicon, we demonstrate that the degradation behaviors in both n-type and p-type silicon are closely correlated. In light of numerous reports on the involvement of hydrogen the potential role of a hydrogen-induced degradation mechanism is discussed in both p-and n-type silicon, particularly in relation to the diffusion of hydrogen and influence of hydrogen-dopant interactions.

The understanding and development of advanced hydrogenation processes for silicon solar cells are presented. Hydrogen passivation is incorporated into virtually all silicon solar cells, yet the properties of hydrogen in silicon are still poorly understood. This is largely due to the complex behaviour of hydrogen in silicon and its ability to exist in many different forms in the lattice. For commercial solar cells, hydrogen is introduced into the device through the deposition of hydrogen-containing dielectric layers and the subsequent metallisation firing process. This process can readily passivate structural defects such as grain boundaries but is ineffective at passivating numerous defects in silicon solar cells such as the boron-oxygen complex, responsible for light-induced degradation in p-type Czochralski silicon. This difficulty is due to the need to first form the boron-oxygen defect and also due to atomic hydrogen naturally occupying low-mobility and low-reactivity charge states. However, these challenges can be overcome using advanced hydrogenation processes incorporating excess carrier generation from illumination or current injection that increase the concentration of the highly mobile and reactive neutral charge state. As a result, after fast firing, additional low-temperature advanced hydrogenation processes incorporating illumination can be implemented to enable the passivation of difficult defects like the boron-oxygen complex. With the implementation of such processes for industrial silicon solar cells, efficiency improvements of 1.1% absolute can be obtained.