2018
DOI: 10.1109/jstqe.2017.2762602
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Monolithic 300 Gb/s Parallel Transmitter in InP-Based Generic Photonic Integration Technology

Abstract: DOI to the publisher's website.• The final author version and the galley proof are versions of the publication after peer review.• The final published version features the final layout of the paper including the volume, issue and page numbers. Link to publication General rightsCopyright and moral rights for the publications made accessible in the public portal are retained by the authors and/or other copyright owners and it is a condition of accessing publications that users recognise and abide by the legal re… Show more

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Cited by 44 publications
(22 citation statements)
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“…The construction of the phenomenological model of the UPM starts from a single ERM. This component is commonly used in InP based PICs as a voltage-driven phase modulator [7,19]. Each of the two ERMs is modeled as a lumped element, which is justified because their lengths are shorter than one tenth of the wavelength of the RF driving signals.…”
Section: Model Descriptionmentioning
confidence: 99%
See 1 more Smart Citation
“…The construction of the phenomenological model of the UPM starts from a single ERM. This component is commonly used in InP based PICs as a voltage-driven phase modulator [7,19]. Each of the two ERMs is modeled as a lumped element, which is justified because their lengths are shorter than one tenth of the wavelength of the RF driving signals.…”
Section: Model Descriptionmentioning
confidence: 99%
“…In photonic integrated circuits (PICs) it is possible and desirable to integrate one or more lasers onto a chip with additional components such as modulators, splitters and filters. This extent of integration allows for a complex circuit with only electrical inputs and a single optical output that can be directly coupled to a fiber, such as a high speed transmitter for telecom applications [7]. The complexity of assembling the full system can thereby be greatly reduced and circuit functionality can be increased.…”
Section: Introductionmentioning
confidence: 99%
“…The complexity directly impacts the performance specification of the PICs. For instance, to achieve more wavelength channels and higher data capacity in the wavelength division multiplexing (WDM) transceiver PICs, high parallelization of laser and modulator arrays is essential . Currently, the highest integration complexity reported among InP PICs is about 1700 components per chip, reported in 2014.…”
Section: Introductionmentioning
confidence: 99%
“…A large degree of integration results in reduced footprint, improved stability and reduced energy consumption [1]- [3]. PICs are readily present in solutions for telecommunication networks [2], [4]- [8], but also increasingly attract attention of other domains. Emerging areas of applications include data-center networks [9], sensing [10], [11], wireless communications, millimeter and terahertz [12]- [14], cryptography [15], [16] and quantum computing [17]- [19].…”
Section: Introductionmentioning
confidence: 99%