Low temperature curable anisotropic conductive films (ACFs) with photo-active curing agent (PA-ACFs)

Abstract

Ultra low temperature curable anisotropic conductive films with photo-active curing agent (PA-ACFs) have been newly developed with crosslinking systems using photoactive curing agents. PA-ACFs cannot be cured at temperature higher than 100 °C before the UV activation, and the crosslinking systems do not work in fluorescent light. However, after the UV activation, PA-ACFs can be cured at 100 °C within 15 seconds. Flex.-on-board (FOB) assembly using PA-ACFs showed the similar adhesion strength and joint resistances than those of the FOB assembly using conventional ACFs.

Interconnection Technology Based on InSn Solder for Flexible Display Applications

“…Combinations of acrylic-based film, SnBi solder powder, and an ultrasonicassisted thermocompression bonding method were proposed to reduce the ACF bonding temperature to 150°C [4]. UV curing of an ACF using a photo-active curing agent (PA-ACF) was introduced to decrease the bonding temperature to 110°C [5]. These studies show a similar approach in using conductive particles as a conductive medium so that the electrical resistance between electrodes may increase, especially for a fine-pitch application of less than 40 μm owing to a limited number of conductive particles in a small electrode area.…”