Interconnection Process Using Laser and Hybrid Underfill for LED Array Module on PET Substrate

Choi, Kwang‐Seong; Braganca, Wagno Alves; Jeong, leeseul; Jang, Keon‐Soo; Moon, Seok Hwan; Bae, Hae-Young; Eom, Yong‐Sung; Cho, Min Kyo; Chang, Seung Il

doi:10.1109/ectc.2018.00238

Cited by 13 publications

(3 citation statements)

References 22 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Thus, various methods have been adopted for the surface modification of PET films, such as chemical modification, heat treatment and plasma treatment. 94–96 For example, Chang et al 97 treated a PET film with oxygen plasma to generate active spots on its surface. Moreover, electronic and optoelectronic devices require ultra-clean and smooth surfaces.…”

Section: Non-functional Polymer Materials In Flexible Electronicsmentioning

confidence: 99%

A review on polymers and their composites for flexible electronics

Han

et al. 2023

Mater. Adv.

View full text Add to dashboard Cite

show abstract

Section: Non-functional Polymer Materials In Flexible Electronicsmentioning

confidence: 99%

A review on polymers and their composites for flexible electronics

Han

et al. 2023

Mater. Adv.

View full text Add to dashboard Cite

show abstract

“…LAB is a semiconductor packaging process in which a laser beam is selectively applied to a target flip-chip die and/or surface-mount component for less than a couple of seconds. [15][16][17][18][19][20] The interaction between the laser beam and the target device increases its temperature, thus allowing it to be metallurgically bonded to a substrate, interposer, or another die. The LAB system (Fig.…”

Section: Laser-assisted Bondingmentioning

confidence: 99%

Characterization of laser beams: theory and application in laser-assisted bonding process

Braganca

Kim

2021

Opt. Eng.

View full text Add to dashboard Cite

The International Organization for Standardization (ISO), in collaboration with the academic community, has developed and published a comprehensive system of standards for the characterization of optical components and laser beams. Our study offers a pedagogical introduction to the theory and application of laser beam characterization in accordance with ISO 13694:2018 and ISO 11145:2018. The characterizing parameters of each ISO standard are presented, defined mathematically, and explained in detail through the use of a minimum working example. A laser beam applied to an actual industrial process [laser-assisted bonding (LAB) process in the semiconductor packaging industry] is thoroughly analyzed to help the reader understand and interpret the characterizing results. Background noise correction and unit conversion methods are also discussed. We target researchers new to the field of laser beam analysis who want the acquire background knowledge, as well as more experienced researchers who want to implement their own laser beam analysis software and propose new definitions for their specific application. Although our study deals with only two ISO standards, the methods covered in our study can be easily applied to other norms that fit the reader's application. Our study should not be treated as a full review of the LAB process nor of the beam profiling instruments and measurement principles. These are only mentioned to enhance the reader's learning experience.

show abstract

“…Therefore, various advanced bonding technologies and bonding materials were recently developed, involving the use of non-conductive paste (NCP) [ 15 ], anisotropic conductive film (ACF) [ 16 , 17 ], and anisotropic conductive paste (ACP) [ 18 , 19 ] materials. Recently, thermo-compression bonding [ 20 ], ultrasonic bonding [ 21 ], and laser bonding technologies [ 22 ] were also developed in place of the mass-reflow bonding method and are now widely used in the flexible materials industries to lower the bonding temperature and to realize uniform and stable bonding.…”

Section: Introductionmentioning

confidence: 99%

Mechanical Reliability Assessment of a Flexible Package Fabricated Using Laser-Assisted Bonding

Hwangbo

et al. 2023

Micromachines

Self Cite

View full text Add to dashboard Cite

The aim of this study was to develop a flexible package technology using laser-assisted bonding (LAB) technology and an anisotropic solder paste (ASP) material ultimately to reduce the bonding temperature and enhance the flexibility and reliability of flexible devices. The heat transfer phenomena during the LAB process, mechanical deformation, and the flexibility of a flexible package were analyzed by experimental and numerical simulation methods. The flexible package was fabricated with a silicon chip and a polyimide (PI) substrate. When the laser beam was irradiated onto the flexible package, the temperatures of the solder increased very rapidly to 220 °C, high enough to melt the ASP solder, within 2.4 s. After the completion of irradiation, the temperature of the flexible package decreased quickly. It was found that the solder powder in ASP was completely melted and formed stable interconnections between the silicon chip and the copper pads, without thermal damage to the PI substrate. After the LAB process, the flexible package showed warpage of 80 μm, which was very small compared to the size of the flexible package. The stress of each component in the flexible package generated during the LAB process was also found to be very low. The flexible device was bent up to 7 mm without failure, and the flexibility can be improved further by reducing the thickness of the silicon chip. The bonding strength and environmental reliability tests also showed the excellent mechanical endurance of the flexible package.

show abstract

Interconnection Process Using Laser and Hybrid Underfill for LED Array Module on PET Substrate

Cited by 13 publications

References 22 publications

A review on polymers and their composites for flexible electronics

A review on polymers and their composites for flexible electronics

Characterization of laser beams: theory and application in laser-assisted bonding process

Mechanical Reliability Assessment of a Flexible Package Fabricated Using Laser-Assisted Bonding

Contact Info

Product

Resources

About