Maskless screen printing technology for 20&amp;#x03BC;m-pitch, 52InSn solder interconnections in display applications

Choi, Kwang‐Seong; Lee, Haksun; Bae, Hae-Young; Eom, Yong‐Sung

doi:10.1109/ectc.2014.6897435

Cited by 2 publications

(3 citation statements)

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“…5 In 51.0 Sn 16.5 over the Sn-free 72 °C mp Bi 33. 7 In 66.3 shell. The 60 °C mp shell allows us to operate the water bath as far away from the boiling point as possible.…”

Section: Resultsmentioning

confidence: 99%

“…This is problematic because the solder based interconnects enable self-alignment during the reflow process. The applications that involve flexible substrates like polyethylene terephthalate and polyethersulfone demand soldering temperature lower than the glass transition temperature (200 °C) . The self-aligned part transfer is of general interest to relax the required precision, which is hard to maintain on flexible and stretchable substrates.…”

Section: Introductionmentioning

confidence: 99%

“…The applications that involve flexible substrates like polyethylene terephthalate and polyethersulfone demand soldering temperature lower than the glass transition temperature (200 °C). 7 The self-aligned part transfer is of general interest to relax the required precision, which is hard to maintain on flexible and stretchable substrates. A transformation-imprinted solder bump, which enables a low-temperature mounting of the objects and self-alignment while providing a route to a high melting point interconnect through transformation, is useful in this field.…”

Section: Introductionmentioning

confidence: 99%

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Core–Shell Transformation-Imprinted Solder Bumps Enabling Low-Temperature Fluidic Self-Assembly and Self-Alignment of Chips and High Melting Point Interconnects

Kaltwasser

Schmidt

Biswas

et al. 2018

ACS Appl. Mater. Interfaces

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We demonstrate the realization of core−shell transformation-imprinted solder bumps to enable low-temperature chip assembly, while providing a route to high-temperature interconnects through transformation. The reported core−shell solder bump uses a lower melting point BiIn-based shell and a higher melting point Sn core in the initial stage. The bumps enable fluidic self-assembly and selfalignment at relatively low temperatures (60−80 °C). The bumps use the high surface free energy of the liquid shell during the self-assembly to capture freely suspended Si dies inside a heated (80 °C) water bath, leading to well-ordered defect-free chip arrays; the molten liquid shell wets the metal contact (binding site) on the chips and yields self-aligned and electrically connected devices. The solid core provides the anchor point to the substrate. After the completion of the assembly, a short reflow raises the melting point, yielding a solid electrical connection. The low melting point liquid diffuses into the high melting point core. The tuning of the material ratios leads to tailored transformation-imprinted solders with high melting points (160−206 °C) in the final structure. KEYWORDS: core−shell transformation-imprinted solder bumps, low-temperature fluidic self-assembly, high melting point interconnects, Pb-free solder bumps, self-alignment

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“…5 In 51.0 Sn 16.5 over the Sn-free 72 °C mp Bi 33. 7 In 66.3 shell. The 60 °C mp shell allows us to operate the water bath as far away from the boiling point as possible.…”

Section: Resultsmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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