Simultaneous Transfer and Bonding (SITRAB) Process for Micro-LEDs Using Laser-Assisted Bonding with Compression (LABC) Process and SITRAB Adhesive

Choi, Kwang‐Seong; Joo, Jiho; Eom, Yong‐Sung; Choi, Gwang‐Mun; Jang, Ki‐Seok; Lee, Chanmi; Moon, Seok Hwan; Yun, Ho-Gyeong; Choi, Jeung‐Yoon; Choi, Ji-Woong

doi:10.1109/ectc32696.2021.00255

Cited by 7 publications

(1 citation statement)

References 21 publications

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“…Once the defective micro-LEDs are identified and located, it is essential to remove and replace the defective chips. Cok et al proposed a redundant pixel design method that places parallel-connected redundant pixels; the redundant pixels replace the function of damaged pixels 106 . Park et al proposed a stamp transfer technique with significant advantages, such as high efficiency, high accuracy, and no damage to the micro-LED 44 .…”

Section: Laser Repair Technology and Mass Transfer Strategies Laser R...mentioning

confidence: 99%

Applications of lasers: A promising route toward low-cost fabrication of high-efficiency full-color micro-LED displays

Lai,

Liu,

et al. 2023

OES

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Micro-light-emitting diodes (micro-LEDs) with outstanding performance are promising candidates for next-generation displays. To achieve the application of high-resolution displays such as meta-displays, virtual reality, and wearable electronics, the size of LEDs must be reduced to the micro-scale. Thus, traditional technology cannot meet the demand during the processing of micro-LEDs. Recently, lasers with short-duration pulses have attracted attention because of their unique advantages during micro-LED processing such as noncontact processing, adjustable energy and speed of the laser beam, no cutting force acting on the devices, high efficiency, and low cost. Herein, we review the techniques and principles of laser-based technologies for micro-LED displays, including chip dicing, geometry shaping, annealing, laserassisted bonding, laser lift-off, defect detection, laser repair, mass transfer, and optimization of quantum dot color conversion films. Moreover, the future prospects and challenges of laser-based techniques for micro-LED displays are discussed.

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Section: Laser Repair Technology and Mass Transfer Strategies Laser R...mentioning

confidence: 99%

Applications of lasers: A promising route toward low-cost fabrication of high-efficiency full-color micro-LED displays

Lai,

Liu,

et al. 2023

OES

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Application of metal interconnection process with micro-LED display by laser-assisted bonding technology

Tian,

Ma,

Cao

et al. 2023

J Mater Sci: Mater Electron

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Tailoring peel strength in UV-responsive, nonconductive adhesives via photocleavable epoxy for micro-LED bonding and repair

Jang,

Kim,

Toan

et al. 2024

Materials Today Communications

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Simultaneous Transfer and Bonding (SITRAB) Process for Micro-LEDs Using Laser-Assisted Bonding with Compression (LABC) Process and SITRAB Adhesive

Cited by 7 publications

References 21 publications

Applications of lasers: A promising route toward low-cost fabrication of high-efficiency full-color micro-LED displays

Applications of lasers: A promising route toward low-cost fabrication of high-efficiency full-color micro-LED displays

Application of metal interconnection process with micro-LED display by laser-assisted bonding technology

Tailoring peel strength in UV-responsive, nonconductive adhesives via photocleavable epoxy for micro-LED bonding and repair

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