Influence of different ratios of a-ODPA/a-BPDA on the properties of phenylethynyl terminated polyimide

Yu, Ping; Wang, Yan; Yu, Junrong; Zhu, Jing; Hu, Zuming

doi:10.1007/s10965-018-1508-4

Cited by 15 publications

(5 citation statements)

References 23 publications

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“…First, the flexible ether linkages were introduced into the molecular structure of the PIs via the ether-containing dianhydride and diamine monomers in order to afford good adhesion to metal substrates, which has been widely adopted for the development of PI adhesives. Secondly, thermally crosslinkable phenylethynyl (PE) end-cappers were incorporated into the molecular structure of the PIs in order to enhance the adhesion reliability of the PI NFMs, which was also widely conducted in the research and development of PI adhesives [29,30]. Thirdly, phenolphthalein groups were incorporated into the molecular structure of the PIs via the diamine monomer.…”

Section: Introductionmentioning

confidence: 99%

Preparation and Properties of Electrospun Phenylethynyl—Terminated Polyimide Nano-Fibrous Membranes with Potential Applications as Solvent-Free and High-Temperature Resistant Adhesives for Harsh Environments

Shen

Jia

et al. 2021

Nanomaterials

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High-temperature-resistant polymeric adhesives with high servicing temperatures and high adhesion strengths are highly desired in aerospace, aviation, microelectronic and other high-tech areas. The currently used high-temperature resistant polymeric adhesives, such as polyamic acid (PAA), are usually made from the high contents of solvents in the composition, which might cause adhesion failure due to the undesirable voids caused by the evaporation of the solvents. In the current work, electrospun preimidized polyimide (PI) nano-fibrous membranes (NFMs) were proposed to be used as solvent-free or solvent-less adhesives for stainless steel adhesion. In order to enhance the adhesion reliability of the PI NFMs, thermally crosslinkable phenylethynyl end-cappers were incorporated into the PIs derived from 3,3’,4,4’-oxydiphthalic anhydride (ODPA) and 3,3-bis[4-(4-aminophenoxy)phenyl]phthalide (BAPPT). The derived phenylethynyl-terminated PETI-10K and PETI-20K with the controlled molecular weights of 10,000 g mol−1 and 20,000 g mol−1, respectively, showed good solubility in polar aprotic solvents, such as N-methyl-2-pyrrolidinone (NMP) and N,N-dimethylacetamide (DMAc). The PI NFMs were successfully fabricated by electrospinning with the PETI/DMAc solutions. The ultrafine PETI NFMs showed the average fiber diameters (dav) of 627 nm for PETI-10K 695 nm for PETI-20K, respectively. The PETI NFMs showed good thermal resistance, which is reflected in the glass transition temperatures (Tgs) above 270 °C. The PETI NFMs exhibited excellent thermoplasticity at elevated temperatures. The stainless steel adherends were successfully adhered using the PETI NFMs as the adhesives. The PI NFMs provided good adhesion to the stainless steels with the single lap shear strengths (LSS) higher than 20.0 MPa either at room temperature (25 °C) or at an elevated temperature (200 °C).

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Section: Introductionmentioning

confidence: 99%

Preparation and Properties of Electrospun Phenylethynyl—Terminated Polyimide Nano-Fibrous Membranes with Potential Applications as Solvent-Free and High-Temperature Resistant Adhesives for Harsh Environments

Shen

Jia

et al. 2021

Nanomaterials

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“…The introduction of asymmetric dianhydride and diamine can not only limit the stacking of main chain and charge transfer electron polarization interaction, but also make polyimide have high Tg and thermal properties. Therefore, polyimides based on molecular or geometric asymmetry exhibit higher solubility, low melt viscosity and other required properties (Yu et al, 2018).…”

Section: Polymer Composites For High-speed Signal Transmission Common...mentioning

confidence: 99%

Progress on Polymer Composites With Low Dielectric Constant and Low Dielectric Loss for High-Frequency Signal Transmission

et al. 2021

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The development of information transmission technology towards high-frequency microwaves and highly integrated and multi-functional electronic devices has been the mainstream direction of the current communication technology. During signal transmission, resistance-capacitance time delay, crosstalk, energy consumption increase and impedance mismatch restrict the high density and miniaturization of Printed circuit board (PCB). In order to achieve high fidelity and low delay characteristics of high-frequency signal transmission, the development of interlayer dielectric materials with low dielectric constant (Dk) and low dielectric loss factor (Df) has become the focus of researchers. This review introduces the dielectric loss mechanism of polymer composites and the resin matrix commonly used in several high-frequency copper-clad laminates, and mainly describes how to reduce the dielectric constant and dielectric loss of materials from the level of molecular structure design, as well as the effect of fillers on the dielectric properties of polymer substrates. As a kind of potential functional fillers for dielectric polymeric composites, the carbon nanofillers are used to tailor the dielectric properties of their composites via different dimensions and loadings, as well as their proper preparation methods. This review finally summarizes the interface bonding failure mechanism and a feasible idea to optimize the dielectric properties of polymer matrix composites is also proposed.

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“…To solve this problem, another way of thinking involves physical modification methods, which have also been proposed. Among these methods, various types of inorganic particles have been used (e.g., graphene oxide, aluminum oxide) for the modification of PIs, which play an important role in improving heat resistance [25][26][27][28]. However, the limitation of this method is that many types of particles have a small change in enhancing the thermal performances of the matrix.…”

Section: Introductionmentioning

confidence: 99%

Preparation and Properties of Modified Phenylethynyl Terminated Polyimide with Neodymium Oxide

et al. 2022

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Modified phenylethynyl terminated polyimides (PIs) were successfully prepared by using neodymium oxide (Nd2O3) via high-speed stirring and ultrasonic dispersion methods. In addition, the structure and properties of the Nd2O3-modified imide oligomers as well as the thermo-oxidative stability of the modified polyimides (PI/Nd2O3 hybrid) and its modification mechanism were investigated in detail. The thermogravimetric analysis (TGA) results indicated that the 5% decomposition temperature (Td5%) of the PI/Nd2O3 hybrids improved from 557 °C to 575 °C, which was also verified by the TGA-IR tests. Meanwhile, the weight loss rate of the PI/Nd2O3 hybrids significantly decreased by 28% to 31% compared to that of pure PI under isothermal aging at 350 °C for 450 h when the added content of Nd2O3 was between 0.4 wt% and 1 wt%, showing outstanding thermo-oxidative stability. Moreover, the mechanism of the enhanced thermo-oxidative stability for the modified PIs was analyzed by scanning electron microscopy (SEM) and X-ray diffraction (XRD).

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Influence of different ratios of a-ODPA/a-BPDA on the properties of phenylethynyl terminated polyimide

Cited by 15 publications

References 23 publications

Preparation and Properties of Electrospun Phenylethynyl—Terminated Polyimide Nano-Fibrous Membranes with Potential Applications as Solvent-Free and High-Temperature Resistant Adhesives for Harsh Environments

Preparation and Properties of Electrospun Phenylethynyl—Terminated Polyimide Nano-Fibrous Membranes with Potential Applications as Solvent-Free and High-Temperature Resistant Adhesives for Harsh Environments

Progress on Polymer Composites With Low Dielectric Constant and Low Dielectric Loss for High-Frequency Signal Transmission

Preparation and Properties of Modified Phenylethynyl Terminated Polyimide with Neodymium Oxide

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