Enhancement of flame retardancy of a colorless and transparent semi-alicyclic polyimide (PI) film was carried out by the incorporation of phosphazene (PPZ) flame retardant (FR). For this purpose, PI-1 matrix was first synthesized from hydrogenated 3,3′,4,4′-biphenyltetracarboxylic dianhydride (HBPDA) and 4,4′-oxydianiline (ODA). The soluble PI-1 resin was dissolved in N,N-dimethylacetamide (DMAc) to afford the PI-1 solution, which was then physically blended with PPZ FR with the loading amounts in the range of 0–25 wt.%. The PPZ FR exhibited good miscibility with the PI-1 matrix when its proportion was lower than 10 wt.% in the composite films. PI-3 composite film with the PPZ loading of 10 wt.% showed an optical transmittance of 75% at the wavelength of 450 nm with a thickness of 50 μm. More importantly, PI-3 exhibited a flame retardancy class of UL 94 VTM-0 and reduced total heat release (THR), heat release rate (HRR), smoke production rate (SPR), and rate of smoke release (RSR) values during combustion compared with the original PI-1 film. In addition, PI-3 film had a limiting oxygen index (LOI) of 30.9%, which is much higher than that of PI-1 matrix (LOI: 20.1%). Finally, incorporation of PPZ FR decreased the thermal stability of the PI films. The 10% weight loss temperature (T10%) and the glass transition temperature (Tg) of the PI-3 film were 411.6 °C and 227.4 °C, respectively, which were lower than those of the PI-1 matrix (T10%: 487.3 °C; Tg: 260.6 °C)

High-temperature-resistant polymeric adhesives with high servicing temperatures and high adhesion strengths are highly desired in aerospace, aviation, microelectronic and other high-tech areas. The currently used high-temperature resistant polymeric adhesives, such as polyamic acid (PAA), are usually made from the high contents of solvents in the composition, which might cause adhesion failure due to the undesirable voids caused by the evaporation of the solvents. In the current work, electrospun preimidized polyimide (PI) nano-fibrous membranes (NFMs) were proposed to be used as solvent-free or solvent-less adhesives for stainless steel adhesion. In order to enhance the adhesion reliability of the PI NFMs, thermally crosslinkable phenylethynyl end-cappers were incorporated into the PIs derived from 3,3’,4,4’-oxydiphthalic anhydride (ODPA) and 3,3-bis[4-(4-aminophenoxy)phenyl]phthalide (BAPPT). The derived phenylethynyl-terminated PETI-10K and PETI-20K with the controlled molecular weights of 10,000 g mol−1 and 20,000 g mol−1, respectively, showed good solubility in polar aprotic solvents, such as N-methyl-2-pyrrolidinone (NMP) and N,N-dimethylacetamide (DMAc). The PI NFMs were successfully fabricated by electrospinning with the PETI/DMAc solutions. The ultrafine PETI NFMs showed the average fiber diameters (dav) of 627 nm for PETI-10K 695 nm for PETI-20K, respectively. The PETI NFMs showed good thermal resistance, which is reflected in the glass transition temperatures (Tgs) above 270 °C. The PETI NFMs exhibited excellent thermoplasticity at elevated temperatures. The stainless steel adherends were successfully adhered using the PETI NFMs as the adhesives. The PI NFMs provided good adhesion to the stainless steels with the single lap shear strengths (LSS) higher than 20.0 MPa either at room temperature (25 °C) or at an elevated temperature (200 °C).

This work describes polyimide (PI) ultrafine fibrous membranes (UFMs) with aligned fibrous structures, fabricated via the high-speed electrospinning procedure. Organo-soluble intrinsically photosensitive PI is utilized as the fiber-forming agent. The effects of different rotating speeds on the fiber morphology and properties are studied. The aligned UFMs possess hydrophobicity, favorable optical properties, and improved deformation durability. The extension strength of the UFMs reinforces obviously with the increased rotating speed and reaches the maximum of 9.18 MPa at 2500 rpm. In addition, due to the photo-cross-link nature of the PI resin, the UFMs present lithography capability, which can obtain micro-sized patterns on aluminum substrates, and even part of the fibrous structure was retained after development. This work shows promise in manufacturing fiber-based photolithographic hierarchical structures on flexible substrates, which exhibit potential in achieving multiple functions on fiber-based electronic devices.

Semi‐alicyclic colorless and transparent polyimide (PI) films with intrinsically flame‐retardant features, excellent optical transparency, and good thermal stability have been designed and successfully prepared. For this target, an aromatic diamine with lateral diphenylphosphine oxide substituent, 2,5‐bis[(4‐aminophenoxy)phenyl]diphenylphosphine oxide (BADPO) was polymerized with two alicyclic dianhydrides, including hydrogenated pyromellitic dianhydride (HPMDA) and hydrogenated 3,3′,4,4′‐biphenyltetracarboxylic dianhydride (HBPDA), respectively, via a one‐step high‐temperature polycondensation procedure to afford two PIs, PI‐a (HPMDA‐BADPO), and PI‐b (HBPDA‐BADPO). The derived PI films maintained the intrinsic good properties for semi‐alicyclic PI films, including excellent optical transparency in the ultraviolet–visible light region with the cutoff wavelength (λcut) around 322 nm and optical transmittance at the wavelength of 450 nm (T450) higher than 83.0%. In addition, the PI films exhibited good thermal stability with the 5% weight loss temperatures (T5%) higher than 460.0°C and glass transition temperatures (Tg) higher than 235.0°C. More importantly, the developed PI films exhibited intrinsic flame retardancy with the limited oxygen indices (LOI) of 41.1% for PI‐a and 28.8% for PI‐b. What is more, the PI films showed the flame retardancy class of UL94 VTM‐0 and low thermal energy and smoke release during combustion.

No abstract