Preparation and Properties of Modified Phenylethynyl Terminated Polyimide with Neodymium Oxide

Zhang, Peng; Liu, Hansong; Yao, Yilun; Yang, Tao; Sun, Jinsong; Zhong, Xiangyu; Bao, Jianwen; Zhao, Yan; Chen, Xiangbao

doi:10.3390/ma15124148

Cited by 3 publications

(3 citation statements)

References 46 publications

(79 reference statements)

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“…Furthermore, the METI-10K NFM was heat-treated at different temperatures, and the FTIR spectra are shown in Figure 5 c. With increasing temperatures, the characteristic absorption peaks of –C≡C– groups gradually weakened and nearly disappeared at about 300 °C, which was mainly due to the crosslinking of the alkynyl groups at this temperature [ 34 ]. Thus, it can be roughly determined that the crosslinking reaction for the current METI-10 NFM occurred at around 300 °C.…”

Section: Resultsmentioning

confidence: 99%

Methylethynyl-Terminated Polyimide Nanofibrous Membranes: High-Temperature-Resistant Adhesives with Low-Temperature Processability

Qi¹,

Ren²,

Liu³

et al. 2022

Polymers

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As an alternative to traditional riveting and welding materials, high-temperature-resistant adhesives, with their unique advantages, have been widely used in aviation, aerospace, and other fields. Among them, polyimide (PI) adhesives have been one of the most studied species both from basic and practical application aspects. However, in the main applications of solvent-type PI adhesives, pinholes or bubbles often exist in the cured PI adhesive layers due to the solvent volatilization and dehydration reaction, which directly affect the adhesive performance. To address this issue, electrospun PI nanofibrous membranes (NFMs) were employed as solvent-free or solvent-less adhesives for stainless steel in the current work. To enhance the adhesion of PI adhesives to the metal substrates, phenolphthalein groups and flexible ether bonds were introduced into the main chain of PIs via the monomers of 4,4′-oxydiphthalic anhydride (ODPA) and 3,3-bis[4-(4-aminophenoxy)phenyl] phthalide (BAPPT). At the same time, the methylethynyl group was used as the end-capping component, and the crosslinking reaction of the alkynyl group at high temperature further increased the adhesive strength of the PI adhesives. Three kinds of methylethynyl-terminated PI (METI) NFMs with the set molecular weights of 5000, 10,000, and 20,000 g/mol were first prepared via the one-step high-temperature polycondensation procedure. Then, the PI NFMs were fabricated via the standard electrospinning procedure from the soluble METI solutions. The afforded METI NFMs showed excellent melt-flowing behaviors at high temperature. Incorporation of the methylethynyl end-capping achieved a crosslinking reaction at 280−310 °C for the NFMs, which was about 70 °C lower than those of the phenylacetylene end-capping counterparts. Using the METI NFMs as adhesive, stainless steel adherends were successfully bonded, and the single-lap shear strength (LSS) was higher than 20.0 MPa at both room temperature (25 °C) and high temperature (200 °C).

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Section: Resultsmentioning

confidence: 99%

Methylethynyl-Terminated Polyimide Nanofibrous Membranes: High-Temperature-Resistant Adhesives with Low-Temperature Processability

Qi¹,

Ren²,

Liu³

et al. 2022

Polymers

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“…Thus, PIs are widely used in many fields, including aeronautical, electronics, and chemical industries [ 11 , 12 , 13 , 14 , 15 ]. Among these, thermosetting PIs are widely utilized in the field of aerospace as a structural matrix [ 16 , 17 , 18 , 19 , 20 ]. However, there are many types of thermosetting PIs, and their different structures determine different performance characteristics.…”

Section: Introductionmentioning

confidence: 99%

The Relationship between Structure and Performance of Different Polyimides Based on Molecular Simulations

Zhang¹,

Dai²,

Liu³

et al. 2023

Polymers

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A polyimide (PI) molecular model was successfully constructed to compare the performance of PIs with different structures. In detail, the structure of the cross-linked PI resin, the prepolymer melt viscosity, and the glass-transition temperature (Tg) were investigated using molecular simulations. The results indicate that benzene ring and polyene-type cross-linked structures dominate the properties of the PIs. Moreover, the prepolymer melt viscosity simulations show that the 6FDA-APB and the ODPA-APB systems have a low viscosity. The results for the Tg and the distribution dihedral angle reveal that the key factor affecting bond flexibility may be the formation of a new dihedral angle after cross-linking, which affects the Tg. The above results provide an important reference for the design of PIs and have important value from the perspective of improving the efficiency of new product development.

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“…Polyimide (PI) resin matrix composites which have excellent electrical, thermal and mechanical stability have gained important applications in aviation equipment, such as wings and airframes of military aircraft, reverser stang fairings, ultra-high-speed fan blades. [1][2][3] After years of work by researchers, [4][5][6][7][8][9][10] composites prepared from PI resin have formed a multilevel material system with temperature resistance ranging from low to high. Currently, the most widely used thermosetting PIs include nadic anhydride-terminated PIs, nitrile-terminated PIs and phenylethynyl-terminated PIs.…”

Section: Introductionmentioning

confidence: 99%

Study on properties influence of carbon fiber reinforced polyimide composites via surface modification using metal mesh

et al. 2022

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In this work, carbon fiber reinforced polyimide (CF/PI) composites via surface modification using metal mesh were obtained. The interfacial adhesion performance of metal mesh and composites, mechanical properties and electrical properties of composites were characterized. The results revealed that introducing metal mesh on CF/PI composites surface obviously decreased the resistivity of composites, which was of great significance for lightning protection.For the mechanical properties, the short-beam shear strength and flexural properties of modified composites slightly declined, and the failure mode of samples did not change significantly. From microscopic failure morphology and finite element analysis, it can be illustrated that the crack generated from edge may lead to the mechanical properties changes of metal mesh modified sample. Based on practical application condition, the performance change rule of modified composite system after thermal treatment was also reported. This study enables a surface modification thought as a promising way for the application of high temperature resistant CF/PI composite system.

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Preparation and Properties of Modified Phenylethynyl Terminated Polyimide with Neodymium Oxide

Cited by 3 publications

References 46 publications

Methylethynyl-Terminated Polyimide Nanofibrous Membranes: High-Temperature-Resistant Adhesives with Low-Temperature Processability

Methylethynyl-Terminated Polyimide Nanofibrous Membranes: High-Temperature-Resistant Adhesives with Low-Temperature Processability

The Relationship between Structure and Performance of Different Polyimides Based on Molecular Simulations

Study on properties influence of carbon fiber reinforced polyimide composites via surface modification using metal mesh

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