Progress on Polymer Composites With Low Dielectric Constant and Low Dielectric Loss for High-Frequency Signal Transmission

Abstract

The development of information transmission technology towards high-frequency microwaves and highly integrated and multi-functional electronic devices has been the mainstream direction of the current communication technology. During signal transmission, resistance-capacitance time delay, crosstalk, energy consumption increase and impedance mismatch restrict the high density and miniaturization of Printed circuit board (PCB). In order to achieve high fidelity and low delay characteristics of high-frequency signal transmission, the development of interlayer dielectric materials with low dielectric constant (Dk) and low dielectric loss factor (Df) has become the focus of researchers. This review introduces the dielectric loss mechanism of polymer composites and the resin matrix commonly used in several high-frequency copper-clad laminates, and mainly describes how to reduce the dielectric constant and dielectric loss of materials from the level of molecular structure design, as well as the effect of fillers on the dielectric properties of polymer substrates. As a kind of potential functional fillers for dielectric polymeric composites, the carbon nanofillers are used to tailor the dielectric properties of their composites via different dimensions and loadings, as well as their proper preparation methods. This review finally summarizes the interface bonding failure mechanism and a feasible idea to optimize the dielectric properties of polymer matrix composites is also proposed.

Biocompatible graphene/chitosan hybrid aerogel reinforced polydimethylsiloxane nanocomposite with excellent dielectric properties

“…Accordingly, the polarization induced by these space charges is able to generate prominent increment of tan δ. However, as the frequency moves toward the high frequency, various polarizations start to lag behind the change of electric field frequency, it becomes gradually harder for the establishment of polarization to keep up the pace with the reversion vector of applied electric field 22 . As a result, the dielectric loss decreases gradually and then tends to stabilize.…”

Reducing Intermolecular Friction Work: Preparation of Polyimide Films with Ultralow Dielectric Loss from MHz to THz Frequency

“…However, the character of easy dissipation of electromagnetic waves at GHz frequencies became an urgent problem to limit the transmission efficiencies and transmission losses (L) of microwaves that are thought to be proportional to the square root of the dielectric constant (D k ), dielectric loss (D f ), and frequency (f) as shown in eq 1. 1,2…”

“…With the rapid development of electronic information technology, working frequencies of antenna systems in aviation, aerospace, transportation, and 5G communication began to shift to GHz bands. However, the character of easy dissipation of electromagnetic waves at GHz frequencies became an urgent problem to limit the transmission efficiencies and transmission losses (L) of microwaves that are thought to be proportional to the square root of the dielectric constant (D k ), dielectric loss (D f ), and frequency (f) as shown in eq . , L ∝ D k 1 / 2 × D f × f …”

“…Therefore, to improve transmission efficiency and reduce energy consumption, wave-transparent materials with low D f values at high frequencies and excellent thermal resistances are in demanded. , Polyimide films (PI) have been widely used at kHz and MHz frequencies due to their excellent general properties. − Nevertheless, the obviously higher D f values of PIs than other nonpolar polymers, such as polytetrafluoroethylene at high frequency, limited the applications of PI films in high frequency communications at GHz or even THz bands. , Thus, reducing the D f of PI films at high frequencies became an urgent problem to be solved, and it was generally accepted that reducing the dielectric constant (D k ) via reducing polar groups or increasing free volumes can also reduce D f at the same time. ,− Kuo at al. reported that decreasing the densities of polar imide rings in PI mainchains by inserting benzene rings or ether groups between imide rings can reduce the D f of PI from 0.0257 to 0.004 at 10 GHz .…”

Dual cross-linking strategy to prepare fluorine-containing poly(arylene ether nitrile) films with a low dielectric constant and ultra-low water uptake

“…With the development of ultra-large-scale integrated circuits (ULSL) with high speed and high integration in the semiconductor industry and the continued miniaturization of the size of electronic devices used in ULSL circuits, there is an urgent need for high-performance low dielectric constant (k ≤ 2.5) and ultra-low dielectric constant (k ≤ 2.0) materials. [1][2][3][4][5] Such dielectric materials reduce capacitance, resistive delay, wire-to-wire crosstalk noise and power consumption between metal interconnects, 6,7 and provides significant application prospects in interlayer dielectrics, semiconductor packaging and high-frequency, low-loss boards. [8][9][10] Compared with inorganic dielectric materials, organic polymers have a lower dielectric constant, a low density and excellent processing and molding properties.…”