Dual cross-linking strategy to prepare fluorine-containing poly(arylene ether nitrile) films with a low dielectric constant and ultra-low water uptake

Cao, Tong; Shi, Yifeng; Li, Xiaoyü; Peng, Jun; Liu, Xiaobo; Huang, Yumin

doi:10.1039/d2py01146h

Cited by 10 publications

(9 citation statements)

References 51 publications

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“…Lei et al 25 prepared PEN/fullerenes composite films, and fullerenes lowered the dielectric constant of this composite film due to its special hollow cage structure. Cao et al 35 designed and synthesized a series of PEN copolymers containing trifluoromethyl groups with two cross‐linking points of nitrile and propylene groups (DnAF‐PEN). By producing a highly cross‐linked structure, the dielectric constant was reduced.…”

Section: Resultsmentioning

confidence: 99%

Effect of molecular weight on properties of polyarylene ether nitrile‐based flexible copper clad laminate

Zhang

Wang

et al. 2023

J of Applied Polymer Sci

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A series of Polyarylene ether nitriles (PENs) with different molecular weights were synthesized and studied the effect of molecular weight size on the performance of PEN and PEN-based flexible copper clad laminate (FCCL). It shows that these PENs have excellent thermal properties with T g > 200 C, T 5% > 500 C, and a long service life at 200 C (2.64 Â 10 3 min, 95 wt% of the residual weight). The tensile mechanical properties of PENs increase gradually as the molecular weight of PENs increases, and the water absorption decreases with the increasing molecular weight of PENs. However, the peer strength of FCCL showed an opposite trend compared to the tensile properties of pure PEN, and the PEN-2 shows the largest peer strength of 12.79 N/cm. Combining the thermal properties, mechanical properties, water absorption rate of PENs, and the peel strength and flexibility of FCCL, PEN-2 is considered to be the most suitable for FCCL.

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Section: Resultsmentioning

confidence: 99%

Effect of molecular weight on properties of polyarylene ether nitrile‐based flexible copper clad laminate

Zhang

Wang

et al. 2023

J of Applied Polymer Sci

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“…From this analysis, it is shown that adding HCP to the PI matrix may significantly weaken the polymer chain orientation and inter‐chain interactions, and thus reduce the stacking density of the polymer chains. [ 26 ]…”

Section: Resultsmentioning

confidence: 99%

“…From this analysis, it is shown that adding HCP to the PI matrix may significantly weaken the polymer chain orientation and inter-chain interactions, and thus reduce the stacking density of the polymer chains. [26] PI films often have a deep yellow color due to the formation of charge transfer complexes (CTC) within or among molecular chains. [27] For instance, Kapton films are generally brown or reddish-brown in color due to the large number of conjugated heterocyclic structures in the molecular structure, which results in strong intramolecular and intermolecular charge transfer.…”

Section: Resultsmentioning

confidence: 99%

All‐Organic Hyper‐Crosslinked Polymer/Polyimide Composite Films with Ultralow High‐Frequency Dielectric Constant

Sun

Yang

Peng

et al. 2023

Macromol. Rapid Commun.

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The ever increasing demand for high‐speed communication at high frequency promotes the rapid development of low‐dielectric polymer films. Aromatic polyimide (PI) has been widely used as the main dielectrics in the flexible circuit board due to its excellent dielectric, mechanical, and thermal properties. Nevertheless, the dielectric constant of PI films at a high frequency range (several GHz) is relatively high and cannot satisfy the requirement of high‐frequency communication. On this basis, a hyper‐crosslinked polymer (HCP) and fabricated all‐organic HCP/PI composite films through a physical blending method is synthesized. The porous structure of HCP is helpful to reduce the dielectric constant of PI matrix. The effects of HCP loadings on the dielectric, mechanical, and thermal properties of HCP/PI composite films are systematically investigated. The dielectric constants of the composite films can be reduced to 1.6–1.8 in the frequency range of 8.2–9.6 GHz when the HCP content reached 10 wt.%. The proposed method in this work is simple and effective to reduce the dielectric constant of PI and can be easily extended to other organic component‐filled PI systems.

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“…[13][14][15][16] It is noteworthy that the nitrile groups on the PEN chain segments can not only undergo cross-linking reactions at a temperature to transform the linear structure into three-dimensional network, resulting in high T g and T 5% , 8,17,18 but also have good adhesion to many substances. 19,20 Nevertheless, the dimensional stability, frequency stability, and intrinsic thermal conductivity of PENs are not well, which affect the safety and application of electronic fields in some extent. Divinyl siloxanebisbenzocyclobutene (BCB) as a thermosetting resin could be used in a variety of microelectronics applications owning to its advantages [21][22][23][24] of low-dielectric constant (2.6-2.7), thermal dimensional stability, outstanding T g , chemical stability, and mechanical processing.…”

Section: Introductionmentioning

confidence: 99%

“…The unique molecular structure provides a sea of advantages, such as high thermal stability, good mechanicals, and tunable dielectric properties via cross‐linking or crystallization 13–16 . It is noteworthy that the nitrile groups on the PEN chain segments can not only undergo cross‐linking reactions at a temperature to transform the linear structure into three‐dimensional network, resulting in high T g and T 5% , 8,17,18 but also have good adhesion to many substances 19,20 . Nevertheless, the dimensional stability, frequency stability, and intrinsic thermal conductivity of PENs are not well, which affect the safety and application of electronic fields in some extent.…”

Section: Introductionmentioning

confidence: 99%

Polyarylene ether nitrile/divinyl siloxane‐bisbenzocyclobutene composite films: Curing reaction and thermal/mechanical/dielectric properties

He,

Liu,

Tong

2023

J of Applied Polymer Sci

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Polymer dielectrics, are commonly used as insulating materials for electronic products. Light weight, good mechanical properties and high thermal conductivity are important properties. However, electrical and thermal parameters are interrelated, and it is challenging to have a dielectric polymer that is also resistant to high temperatures and high thermal conductivity. Hence, high‐performance composite films were prepared by the method of post‐solid phase chemical reaction using polyarylene ether nitrile (PEN) and divinyl siloxane‐bisbenzocyclobutene (BCB) as raw materials. First, parameters of the curing reaction were determined by rheological and activation energy calculations. Then, through adjusting the content of BCB resin and treatment temperature, the performance of PEN/BCB composites could be tuned. Thermal properties have been studied by differential scanning calorimetry, dynamic mechanical analysis, thermal gravimetric analysis, and hot‐disk method. Here, the PEN/BCB composite electric insulating materials with outstanding thermal performance (Tg: 208–400°C, T5%: 469–544°C, thermal conductivity: 1.270–2.215 W/m K). Besides, its mechanical and dielectric properties were investigated in detail. It is noteworthy that the tensile strength of composite film can exceed a maximum of 130 MPa, which is 23.19% higher compared to the untreated one. Also, PEN/BCB composites own low dielectric constant (2.27–4.08 at 1 KHz), and the relationship between frequency or a wide temperature range and dielectric constant/loss is stable. Thus, it has a greater potential for applications in electronics in high‐temperature environments.

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Dual cross-linking strategy to prepare fluorine-containing poly(arylene ether nitrile) films with a low dielectric constant and ultra-low water uptake

Abstract: Low k-value in humid environment is an important parameter for low dielectric materials, as k-value is very sensitive to humidity. In order to obtain low dielectric constant and improve the...

Cited by 10 publications

References 51 publications

Effect of molecular weight on properties of polyarylene ether nitrile‐based flexible copper clad laminate

Effect of molecular weight on properties of polyarylene ether nitrile‐based flexible copper clad laminate

All‐Organic Hyper‐Crosslinked Polymer/Polyimide Composite Films with Ultralow High‐Frequency Dielectric Constant

Polyarylene ether nitrile/divinyl siloxane‐bisbenzocyclobutene composite films: Curing reaction and thermal/mechanical/dielectric properties

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