Abstract:Polymer dielectrics, are commonly used as insulating materials for electronic products. Light weight, good mechanical properties and high thermal conductivity are important properties. However, electrical and thermal parameters are interrelated, and it is challenging to have a dielectric polymer that is also resistant to high temperatures and high thermal conductivity. Hence, high‐performance composite films were prepared by the method of post‐solid phase chemical reaction using polyarylene ether nitrile (PEN)… Show more
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