High thermal conductivity and high electrical resistivity of poly(vinylidene fluoride)/polystyrene blends by controlling the localization of hybrid fillers

Anisotropic thermal conductive properties of hot-pressed polystyrene/graphene composites in the through-plane and in-plane directions

“…For example, Cao et al [6] reported that the thermal conductivity of the poly(vinylidene fluoride)/polystyrene (PS) composites with both multi-walled carbon nanotubes (MWCNTs) and silicon carbide (SiC) is higher than that with only SiC. They found the following factors were responsible for this phenomenon.…”

A review on thermally conductive polymeric composites: classification, measurement, model and equations, mechanism and fabrication methods

“…Unfortunately, the intrinsic low thermally conductive coefficient (λ) and insufficient thermal stability of polymeric matrix have restricted its broader application in the areas which require good heat dissipation and low thermal expansion [12][13][14][15][16][17][18][19].…”

High-performance epoxy/silica coated silver nanowire composites as underfill material for electronic packaging

“…Hence, a suitable strategy to prepare high-performance epoxybased composites with high thermal conductivity, high electrical insulation, low relative permittivity, low dielectric loss and low viscosity has been a critical issue for underfill process in electronic packaging. Early attempts were to incorporate ceramic fillers with high thermal conductivity into the epoxy resins, such as boron nitride (BN) [9], aluminum nitride (AlN) [10], aluminum oxide (Al 2 O 3 ) [11], and silicon carbide [12,13]. To achieve high thermal conductivity, high filler loading is often required leading to worsened mechanical properties and high viscosity which is unsuitable for underfill process [14].…”