A review on thermally conductive polymeric composites: classification, measurement, model and equations, mechanism and fabrication methods

Abstract

With the fast-developing miniaturization and integration of microelectronics packaging materials, ultrahigh-voltage electrical devices, light-emitting diodes (LEDs), and in areas which require good heat dissipation and low thermal expansion, the investigations on the polymeric composites with highly thermal conductivities and excellent thermal stabilities are urgently required, which would be beneficial to transferring the heat to the outside of the products, finally to effectively avoid substantial overheating and prolong their working life. Our article reviews recent progress in the classification, measurement methods, model and equations, mechanisms, commonly used thermally conductive fillers, and the correlative fabrication methods for the thermally conductive polymeric composites, aiming to understand and grasp how to enhance the λ value effectively. And future perspectives, focusing scientific problems and technical difficulties of the present thermally conductive polymeric composites are also described and evaluated.

Enhanced toughness and thermal conductivity for epoxy resin with a core–shell structured polyacrylic modifier and modified boron nitride

“…[50][51][52][53][54][55][56][57] Researchers have shown that functionalized h-BN has high thermal conductivity, excellent thermal properties, and that it can be incorporated as a conductive ller in polymeric matrices. [58][59][60][61][62][63][64] Gu et al used NH 2 -POSS functionalized nBN llers to improve the thermal conductivities for PPS dielectric nanocomposites. 58 However, research on improving both the thermal conductivity and toughness of epoxy matrix is scarce and not widely reported.…”

Silver Nanowires Contained Nanofluids with Enhanced Optical Absorption and Thermal Transportation Properties

“…Some researchers have found that thermal conductivity of nanofluids is determined by many factors. For example, the properties (size, shape, concentration, dispersibility, and surface charge) of nanoparticle, base fluids, temperature, and so on . The effects of base fluids refer to the property of base fluids and viscosity.…”

Enhanced thermal conductivity for traditional epoxy packaging composites by constructing hybrid conductive network

“…The rapid development of electronic technology and the emergence of emerging industries have put higher requirement on the thermal performance of the traditional packaging materials [1][2][3][4]. Most polymers have the advantages of good processability, low cost and excellent insulation, etc, but the lower thermal conductivity of polymers (around 0.1-0.3 W m −1 K −1 ) limits the application in the field of thermally conductive packaging [5][6][7]. In order to ensure the great stability and lifetime in practical application of materials, thermally conductive fillers are widely used to improve the thermal conductivity of the composites [8][9][10][11][12].…”