Enhanced thermal conductivity for traditional epoxy packaging composites by constructing hybrid conductive network

Abstract

A cost-efficient and practical strategy was developed for preparing high thermal conductive epoxy packaging composites. The effective conductive network was constructed by the bridging effect between boron nitride (BN) and spherical silica (SiO 2 ). Compared to the epoxy (EP) composites with randomly dispersed BN and SiO 2 , the EP/SiO 2 @BN showed a great enhancement in thermal conduction. The thermal conductivity of EP/SiO 2 @BN reached to 0.86 Wm −1 K −1 with 60 wt% content of hybrid filler, which was 91% higher than that of EP/SiO 2 samples and was around 12% higher than that of epoxy composites with unmodified BN and SiO 2 . In addition, the EP/SiO 2 @BN exhibited lower thermal interface resistance in comparison with EP/SiO 2 &BN composites according to the effective medium theory (EMT). The encapsulation of BN on the surface of SiO 2 greatly enhanced the thermal transfer efficiency of the epoxy matrix and showed great potential in the epoxy packaging practical application.

Enhanced in-plane thermal conductivity of polyimide-based compositesvia in situinterfacial modification of graphene

“…6a-c, in contrast to PI and GNS/PI, the low chromatic gradient indicated that M@GNS/PI had coherent and oriented heat conductive pathways for rapid diffusion. In addition, it can be found from the temperature vector diagram that the temperature difference between the points (0, 0) and (25,25) of M@GNS 15 /PI (30.58 °C) was much lower than those of GNS 15 /PI (48.83 °C) with inefficient transfer pathways and PI (143.2 °C) without transfer pathways (Fig. 6d-f).…”

“…Interface thermal resistance ( R i ) was obtained as follows: 24,25 K c = K PI [3 + 2 V f ( λ ∥ + λ ⊥ )]/(3 − V f λ ⊥ ) λ ⊥ = 2[ d ( K GNS − K PI ) − 2 R i K GNS K PI ]/[ d ( K GNS + K PI ) + 2 R i K GNS K PI ] λ ∥ = [ L ( K GNS − K PI ) − 2 R i K GNS K PI ]/( LK PI + 2 R i K GNS K PI )where V f represents the volume fraction of M@GNS (or GNS), K GNS denotes the thermal conductivity of GNS (calculated according to the theoretical value of 5000 W m −1 K −1 ). 16 L and d represent the length and thickness of M@GNS (or GNS), respectively.…”

“…where K c and K PI are the thermal conductivity of M@GNS/PI (or GNS/PI) and PI, respectively. Interface thermal resistance (R i ) was obtained as follows: 24,25…”

Enhancement of the effective thermal conductivity of iron oxide‐coated hexagonal boron nitride/polyimide composite sheets using samarium–cobalt magnets

“…The tensile strength values of 10, 20, and 30 vol% Fe 3 O 4 @hBN/PI samples with MFT were 33%, 33%, and 22% lower, respectively, than those of samples without MFT; the Fe 3 O 4 @hBN filler agglomerates should become defects in the sheets after MFT, and the columnar structure of Fe 3 O 4 @hBN that formed in the out-of-plane direction of the sheets limited the entanglement of polymer chains in the tensile direction (in-plane direction of the sheets). 16,40…”

“…[9][10][11][12][13] However, it exhibits a low thermal conductivity (TC). To overcome this limitation, fillers with high TC, such as ceramics [14][15][16] and carbon fillers, [17][18][19] have been used. Hexagonal boron nitride (hBN) is an excellent ceramic filler with high TC, good electrical insulation, and chemical stability.…”