High-performance epoxy/silica coated silver nanowire composites as underfill material for electronic packaging

Chen, Chao; Tang, Yongjun; Ye, Yun Sheng; Xue, Zhigang; Yang, Xue; Xie, Xiaolin; Mai, Yiu‐Wing

doi:10.1016/j.compscitech.2014.10.002

Cited by 147 publications

(58 citation statements)

References 48 publications

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“…Owing to the unique physics and chemistry that occur at the nanoscale, nanocomposites are being developed for numerous technological applications, including construction and infrastructure development; 1-4 food 5,6 and electronic 7,8 packaging; biomedical devices and materials; 9-11 and automotive/aerospace materials. 12-14 …”

Section: Introductionmentioning

confidence: 99%

Environmental release of core–shell semiconductor nanocrystals from free-standing polymer nanocomposite films

Pillai

Gray

Tien

et al. 2016

Environ. Sci.: Nano

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Concomitant with the development of polymer nanocomposite (PNC) technologies across numerous industries is an expanding awareness of the uncertainty with which engineered nanoparticles embedded within these materials may be released into the external environment, particularly liquid media. Recently there has been an interest in evaluating potential exposure to nanoscale fillers from PNCs, but existing studies often rely upon uncharacterized, poor quality, or proprietary materials, creating a barrier to making general mechanistic conclusions about release phenomena. In this study we employed semiconductor nanoparticles (quantum dots, QDs) as model nanofillers to quantify potential release into liquid media under specific environmental conditions. QDs of two sizes were incorporated into low-density polyethylene by melt compounding and the mixtures were extruded as free-standing fluorescent films. These films were subjected to tests under conditions intended to accelerate potential release of embedded particles or dissolved residuals into liquid environments. Using inductively-coupled plasma mass spectrometry and laser scanning confocal microscopy, it was found that the acidity of the external medium, exposure time, and small differences in particle size (on the order of a few nm) all play pivotal roles in release kinetics. Particle dissolution was found to play a major if not dominant role in the release process. This paper also presents the first evidence that internally embedded nanoparticles contribute to the mass transfer, an observation made possible via the use of a model system that was deliberately designed to probe the complex relationships between nanoparticle-enabled plastics and the environment.

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Section: Introductionmentioning

confidence: 99%

Environmental release of core–shell semiconductor nanocrystals from free-standing polymer nanocomposite films

Pillai

Gray

Tien

et al. 2016

Environ. Sci.: Nano

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“…These underfill adhesives typically contain fillers such as silica particles, which decreases the coefficient of thermal expansion and increases the Young's modulus [11][12][13][14]. However, underfills between components and PCBs often do not contain fillers, which lowers the cost of manufacturing and processing [15].…”

Section: Introductionmentioning

confidence: 99%

Bending strength of adhesive joints in microelectronic components: Comparison of edge-bonding and underfilling

Akbari

Nourani

Spelt

2016

Composites Part A: Applied Science and Manufacturing

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“…In recent years, many studies have reported the preparation of conductive thin films by coating AgNWs on a surface, leading to the widespread application of AgNW–optical grade polymer mixtures in touch screens and liquid crystal displays, since AgNWs provide good heat dissipation when incorporated into microelectronic and nanoelectronic components. Hence, many studies have also begun to focus on AgNW–polymer mixtures in recent years . AgNWs have higher atomic steps and more unsaturated bonds, leading to a higher surface energy, which makes the material more likely to undergo chemical reactions .…”

Section: Introductionmentioning

confidence: 99%

“…Consequently, AgNWs are prone to oxidation when they come into contact with air and water vapour and cannot resist oxidative corrosion, especially in a high‐temperature and high‐humidity environment, leading to a significant drop in their functionality and scope of application. So far, most studies have used expensive coating machines and multi‐pass surface modification methods to improve the conductive properties of thin films . However, in this study, polybenzoxazine (PBZ)/epoxy (Epo) copolymer with low cost and high resistance is used along with a time‐saving, one‐pass hot pressing method for preparing large‐area conductive films.…”

Section: Introductionmentioning

confidence: 99%

Fabrication and characteristics of graphene‐reinforced silver nanowire/polybenzoxazine/epoxy copolymer composite thin films

Chou

Tsai

Hsu

et al. 2018

Polymer International

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In this study, composite thin films were fabricated by mixing one‐dimensional silver nanowires (AgNWs) with graphene, polybenzoxazine (PBZ) and epoxy. Their electrical and thermal properties under different environmental conditions were investigated. The AgNWs were prepared by a polyol reduction method using ethylene glycol as a reducing agent and polyvinylpyrrolidone as a soft template to reduce silver ions. High aspect ratio AgNWs were then mixed into polymer matrices to allow them to form electrical and thermal conductive paths. Next, a trace amount of graphene was added into the nanocomposites in order to enhance their electrical and thermal properties. The results showed that the addition of graphene and AgNWs improved the threshold leakage current, and a 33% increase in thermal diffusivity was observed. The water resistance and gas barrier properties of PBZ and graphene effectively improved the thermal oxidation stability, and a 200% increase in electrical conductivity was achieved after 120 h of thermal oxidation treatment. A considerable difference was observed between the moduli of epoxy and PBZ. Hardness and phase analyses using atomic force microscopy showed that material modulus mismatch occurred across the interface between the materials, triggering phonon scattering. However, the increase in thermal conductivity was not significant for either material. © 2018 Society of Chemical Industry

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High-performance epoxy/silica coated silver nanowire composites as underfill material for electronic packaging

Cited by 147 publications

References 48 publications

Environmental release of core–shell semiconductor nanocrystals from free-standing polymer nanocomposite films

Environmental release of core–shell semiconductor nanocrystals from free-standing polymer nanocomposite films

Bending strength of adhesive joints in microelectronic components: Comparison of edge-bonding and underfilling

Fabrication and characteristics of graphene‐reinforced silver nanowire/polybenzoxazine/epoxy copolymer composite thin films

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