Bending strength of adhesive joints in microelectronic components: Comparison of edge-bonding and underfilling

Akbari, Saeed; Nourani, Amir; Spelt, J.K.

doi:10.1016/j.compositesa.2016.05.030

Composites Part A: Applied Science and Manufacturing

2016

DOI: 10.1016/j.compositesa.2016.05.030

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Bending strength of adhesive joints in microelectronic components: Comparison of edge-bonding and underfilling

Saeed Akbari

Amir Nourani

J.K. Spelt

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Cited by 6 publications

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Bending strength of adhesive joints in microelectronic components: Comparison of edge-bonding and underfilling

Cited by 6 publications

References 28 publications

Predicting delamination in multilayer composite circuit boards with bonded microelectronic components

Predicting delamination in multilayer composite circuit boards with bonded microelectronic components

Anti-gravitational 3D printing of polycaprolactone-bonded Nd-Fe-B based on fused deposition modeling

Modelling of the residual atmosphere in vacuum devices with internal adhesive joints

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