Abstract:Al In N ∕ Ga N heterostructures have been proposed to possess advantageous properties for field-effect transistors (FETs) over AlGaN∕GaN [Kuzmík, IEEE Electron Device Lett. 22, 501 (2001); Yamaguchi et al., Phys. Status Solidi A 188, 895 (2001)]. A major advantage of such structures is that AlInN can be grown lattice-matched to GaN while still inducing high charge carrier densities at the heterointerface of around 2.7×1013cm−3 by the differences in spontaneous polarization. Additionally, it offers a higher ban… Show more
“…On the other hand, InN can only be grown at low temperatures and high ammonia partial pressures, whereby high ammonia partial pressures have also a strong effect on the AlN growth rate. However, these problems have been widely overcome in first promising experiments [8][9][10][11]. In particular, it has been found that the insertion of an optimized AlN interlayer reduces the alloy related interface roughness and improves therefore the electron mobility dramatically as shown in Fig.…”
Abstract:The InAlN/GaN heterojunction appears to be a new alternative to the common AlGaN/GaN configuration with higher sheet charge density and higher thermal stability, promising very high power and temperature performance as well as robustness. This new system opens up the possibility to scale the barrier down to 5 nm while maintaining nearly its ideal materials and device properties. The status, focussing on the lattice matched materials configuration, is reviewed.
“…On the other hand, InN can only be grown at low temperatures and high ammonia partial pressures, whereby high ammonia partial pressures have also a strong effect on the AlN growth rate. However, these problems have been widely overcome in first promising experiments [8][9][10][11]. In particular, it has been found that the insertion of an optimized AlN interlayer reduces the alloy related interface roughness and improves therefore the electron mobility dramatically as shown in Fig.…”
Abstract:The InAlN/GaN heterojunction appears to be a new alternative to the common AlGaN/GaN configuration with higher sheet charge density and higher thermal stability, promising very high power and temperature performance as well as robustness. This new system opens up the possibility to scale the barrier down to 5 nm while maintaining nearly its ideal materials and device properties. The status, focussing on the lattice matched materials configuration, is reviewed.
“…10 Regardless of the final application, investigations on both the electrical and optical properties of the 2DEG are crucial for understanding the intrinsic properties of the InAlN/GaN heterostructures, which is the bottleneck to advance the nitride electronics technology. Up to now, InAlN/GaN HS have been studied widely by electrical measurements, 5,11 however, there is still a lack of systematic studies concerning optical characterization.…”
Time-resolved photoluminescence, positron annihilation, and Al0.23Ga0.77N/GaN heterostructure growth studies on low defect density polar and nonpolar freestanding GaN substrates grown by hydride vapor phase epitaxy J. Appl. Phys. 111, 103518 (2012) Modeling of carrier lifetimes in uniaxially strained GaAs J. Appl. Phys. 111, 103704 (2012) Observation of band alignment transition in InAs/GaAsSb quantum dots by photoluminescence J. Appl. Phys. 111, 104302 (2012) The role of glass-viscosity on the growth of semiconductor quantum dots in glass matrices
“…[1][2][3][4][5] Despite their potential applications in electronic and optical devices, the fabrication of high quality lattice-matched InAlN epitaxial layers on GaN remains challenging task irrespective of employing sophisticated epitaxial deposition methods such as molecular beam epitaxy (MBE) and metal-organic chemical vapor deposition (MOCVD). The spinodal phase separation and composition inhomogeneity due to the large thermodynamic miscibility gap caused by the large difference of covalent bond length between AlN and InN makes it difficult in alloying at optimum growth temperature.…”
We investigate the role of growth temperature on the optimization of lattice-matched In0.17Al0.83N/GaN heterostructure and its structural evolutions along with electrical transport studies. The indium content gradually reduces with the increase of growth temperature and approaches lattice-matched with GaN having very smooth and high structural quality at 450ºC. The InAlN layers grown at high growth temperature (480ºC) retain very low Indium content of ∼ 4 % in which cracks are mushroomed due to tensile strain while above lattice matched (>17%) layers maintain crack-free compressive strain nature. The near lattice-matched heterostructure demonstrate a strong carrier confinement with very high two-dimensional sheet carrier density of ∼2.9 × 1013 cm−2 with the sheet resistance of ∼450 Ω/□ at room temperature as due to the manifestation of spontaneous polarization charge differences between InAlN and GaN layers.
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